Effect of cooling on the probe system sensitivity for low signal strength RFI problems

Guang Hua Li, Wei Huang, David Pommerenke

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Only highly sensitive probe systems can detect the weak field strengths that cause radio-frequency-interference (RFI) problems typically found within cell phones. The sensitivity of the probe systems depends on the probe factor and on the noise floor. The effect of cooling by liquid nitrogen on the received signal strength and the noise floor of three resonant probe systems has been investigated. They operate at the GSM, GPS, and WiFi frequency bands. Cooling increases the Q-factor of these resonant probes, increases the received signal, and lowers the noise floor. The sensitivity of the system, defined as the signal strength at which the Signal-to-Noise Ratio is equal to 0 dB improves by 3-6 dB.

Original languageEnglish
Title of host publicationProceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
Pages134-137
Number of pages4
DOIs
Publication statusPublished - 1 Dec 2013
Externally publishedYes
Event2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013 - Denver, CO, United States
Duration: 5 Aug 20139 Aug 2013

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

Conference2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
CountryUnited States
CityDenver, CO
Period5/08/139/08/13

Keywords

  • Quality factor
  • radio-frequency interference (RFI)
  • resonant magnetic field probe
  • signal-to-noise ratio

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • Cite this

    Li, G. H., Huang, W., & Pommerenke, D. (2013). Effect of cooling on the probe system sensitivity for low signal strength RFI problems. In Proceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013 (pp. 134-137). [6670396] (IEEE International Symposium on Electromagnetic Compatibility). https://doi.org/10.1109/ISEMC.2013.6670396