Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide

Lucia D´Urzo, Stijn Schaltin, Andrey Shkurankov, Harald Plank, Gerald Kothleitner, Christian Gspan

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	945-951
Journal	Journal of Materials Science
Volume	23
Issue number	4
DOIs	https://doi.org/10.1007/s10854-011-0525-4
Publication status	Published - 2012

Fields of Expertise

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title = "Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide",

author = "Lucia D´Urzo and Stijn Schaltin and Andrey Shkurankov and Harald Plank and Gerald Kothleitner and Christian Gspan",

note = "Materials in Electronics",

year = "2012",

doi = "10.1007/s10854-011-0525-4",

language = "English",

volume = "23",

pages = "945--951",

journal = "Journal of Materials Science",

publisher = "Springer Netherlands",

number = "4",

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TY - JOUR

T1 - Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide

AU - D´Urzo, Lucia

AU - Schaltin, Stijn

AU - Shkurankov, Andrey

AU - Plank, Harald

AU - Kothleitner, Gerald

AU - Gspan, Christian

N1 - Materials in Electronics

PY - 2012

Y1 - 2012

U2 - 10.1007/s10854-011-0525-4

DO - 10.1007/s10854-011-0525-4

M3 - Article

VL - 23

SP - 945

EP - 951

JO - Journal of Materials Science

JF - Journal of Materials Science

IS - 4

ER -