Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide

Lucia D´Urzo, Stijn Schaltin, Andrey Shkurankov, Harald Plank, Gerald Kothleitner, Christian Gspan

Research output: Contribution to journalArticleResearchpeer-review

Original languageEnglish
Pages (from-to)945-951
JournalJournal of Materials Science
Volume23
Issue number4
DOIs
Publication statusPublished - 2012

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

Cite this

Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide. / D´Urzo, Lucia; Schaltin, Stijn; Shkurankov, Andrey; Plank, Harald; Kothleitner, Gerald; Gspan, Christian.

In: Journal of Materials Science, Vol. 23, No. 4, 2012, p. 945-951.

Research output: Contribution to journalArticleResearchpeer-review

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title = "Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide",
author = "Lucia D´Urzo and Stijn Schaltin and Andrey Shkurankov and Harald Plank and Gerald Kothleitner and Christian Gspan",
note = "Materials in Electronics",
year = "2012",
doi = "10.1007/s10854-011-0525-4",
language = "English",
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T1 - Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide

AU - D´Urzo, Lucia

AU - Schaltin, Stijn

AU - Shkurankov, Andrey

AU - Plank, Harald

AU - Kothleitner, Gerald

AU - Gspan, Christian

N1 - Materials in Electronics

PY - 2012

Y1 - 2012

U2 - 10.1007/s10854-011-0525-4

DO - 10.1007/s10854-011-0525-4

M3 - Article

VL - 23

SP - 945

EP - 951

JO - Journal of Materials Science

JF - Journal of Materials Science

SN - 0022-2461

IS - 4

ER -