Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide

L. D'Urzo, Stijn Schaltin, Andrey Shkurankov, Harald Plank, Gerald Kothleitner, Koen Binnemans, Jan Fransaer

Research output: Contribution to journalArticleResearchpeer-review

Original languageEnglish
Pages (from-to)647-653
JournalJournal of the Electrochemical Society
Volume158
Publication statusPublished - 2011

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Application
  • Experimental

Cite this

Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide. / D'Urzo, L.; Schaltin, Stijn; Shkurankov, Andrey; Plank, Harald; Kothleitner, Gerald; Binnemans, Koen; Fransaer, Jan.

In: Journal of the Electrochemical Society, Vol. 158, 2011, p. 647-653.

Research output: Contribution to journalArticleResearchpeer-review

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journal = "Journal of the Electrochemical Society",
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T1 - Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide

AU - D'Urzo, L.

AU - Schaltin, Stijn

AU - Shkurankov, Andrey

AU - Plank, Harald

AU - Kothleitner, Gerald

AU - Binnemans, Koen

AU - Fransaer, Jan

PY - 2011

Y1 - 2011

M3 - Article

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EP - 653

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

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