TY - GEN
T1 - Development and validation of a microcontroller model for EMC
AU - Li, Shaohua
AU - Bishnoi, Hemant
AU - Whiles, Jason
AU - Ng, Pius
AU - Weng, Haixiao
AU - Pommerenke, David
AU - Beetner, Daryl
PY - 2008/1/1
Y1 - 2008/1/1
N2 - Models of integrated circuits (ICs) allow printed circuit board (PCB) developers to predict radiated and conducted emissions early in board developm nt and allow IC manufactures insight into how to build their ICs better for electromagnetic compatibility (EMC). A model of the power delivery network, similar to the ICEM or LECCS model, was developed for a microcontroller running a typical program and used to predict the noise voltage between the power and return planes of a PCB. The IC and package model was generated using the Apache tool suite. A model of the PCB was created using an electromagnetic cavity model and lumped-element models of components on the board. Values of predicted and measured impedance looking into the IC and PCB matched within a few dB from a few 10s of MHz up to 1 GHz. Measured and predicted values of noise voltage matched within about 6 dB at clock harmonics up to 600-700 MHz
AB - Models of integrated circuits (ICs) allow printed circuit board (PCB) developers to predict radiated and conducted emissions early in board developm nt and allow IC manufactures insight into how to build their ICs better for electromagnetic compatibility (EMC). A model of the power delivery network, similar to the ICEM or LECCS model, was developed for a microcontroller running a typical program and used to predict the noise voltage between the power and return planes of a PCB. The IC and package model was generated using the Apache tool suite. A model of the PCB was created using an electromagnetic cavity model and lumped-element models of components on the board. Values of predicted and measured impedance looking into the IC and PCB matched within a few dB from a few 10s of MHz up to 1 GHz. Measured and predicted values of noise voltage matched within about 6 dB at clock harmonics up to 600-700 MHz
KW - Decoupling
KW - Electromagnetic compatibility
KW - Emissions
KW - Integrated circuit design
KW - Modeling; power Integrity
UR - http://www.scopus.com/inward/record.url?scp=63549127609&partnerID=8YFLogxK
U2 - 10.1109/EMCEUROPE.2008.4786860
DO - 10.1109/EMCEUROPE.2008.4786860
M3 - Conference contribution
AN - SCOPUS:63549127609
SN - 9781424427376
T3 - IEEE International Symposium on Electromagnetic Compatibility
BT - 2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008
ER -