Development and validation of a microcontroller model for EMC

Shaohua Li*, Hemant Bishnoi, Jason Whiles, Pius Ng, Haixiao Weng, David Pommerenke, Daryl Beetner

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Models of integrated circuits (ICs) allow printed circuit board (PCB) developers to predict radiated and conducted emissions early in board developm nt and allow IC manufactures insight into how to build their ICs better for electromagnetic compatibility (EMC). A model of the power delivery network, similar to the ICEM or LECCS model, was developed for a microcontroller running a typical program and used to predict the noise voltage between the power and return planes of a PCB. The IC and package model was generated using the Apache tool suite. A model of the PCB was created using an electromagnetic cavity model and lumped-element models of components on the board. Values of predicted and measured impedance looking into the IC and PCB matched within a few dB from a few 10s of MHz up to 1 GHz. Measured and predicted values of noise voltage matched within about 6 dB at clock harmonics up to 600-700 MHz

Original languageEnglish
Title of host publication2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008
DOIs
Publication statusPublished - 1 Jan 2008
Externally publishedYes
Event2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 - Detroit, United States
Duration: 18 Aug 200822 Aug 2008

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076

Conference

Conference2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008
CountryUnited States
CityDetroit
Period18/08/0822/08/08

Keywords

  • Decoupling
  • Electromagnetic compatibility
  • Emissions
  • Integrated circuit design
  • Modeling; power Integrity

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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