Designing A 3D printing based channel emulator

Xiangyang Jiao; Hui He; Guanghua Li; Wei Qian; Guangyao Shen; David Pommerenke; Chong Ding; Douglas White; Stephen Scearce; Yaochao Yang

doi:10.1109/ISEMC.2014.6899106

Designing A 3D printing based channel emulator

Xiangyang Jiao, Hui He, Guanghua Li, Wei Qian, Guangyao Shen, David Pommerenke, Chong Ding, Douglas White, Stephen Scearce, Yaochao Yang

Research output: Contribution to journal › Conference article

Abstract

This research explored the possibility of building channel emulators by utilizing fused deposition modeling (FDM) 3D printing technology, which provides a rapid and low cost method with high flexibility to produce parts with many shapes of interest. Algorithms are developed for obtaining the printing pattern and loss profile based on S parameters of a target channel to be emulated. Parts with different dielectric constants, and loss tangents can be printed using filament with high dielectric constant or conductive fillers. Those parts will be placed on a low loss transmission line. As a result, different channel emulators can be built with the advantage of avoiding complicated electronic components, and only being limited in the frequency range by the base trace and its connectors.

Original language	English
Article number	6899106
Pages (from-to)	956-960
Number of pages	5
Journal	IEEE International Symposium on Electromagnetic Compatibility
Volume	2014-September
Issue number	September
DOIs	https://doi.org/10.1109/ISEMC.2014.6899106
Publication status	Published - 15 Sep 2014
Externally published	Yes
Event	2014 IEEE International Symposium on Electromagnetic Compatibility: EMC 2014 - Raleigh, United States Duration: 3 Aug 2014 → 8 Aug 2014

Keywords

3D printing
channel emulator
dielectric constants
FDM
Transmission line

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/ISEMC.2014.6899106

Link to publication in Scopus

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Designing A 3D printing based channel emulator. / Jiao, Xiangyang; He, Hui; Li, Guanghua; Qian, Wei; Shen, Guangyao; Pommerenke, David; Ding, Chong; White, Douglas; Scearce, Stephen; Yang, Yaochao.

In: IEEE International Symposium on Electromagnetic Compatibility, Vol. 2014-September, No. September, 6899106, 15.09.2014, p. 956-960.

Research output: Contribution to journal › Conference article

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AU - Ding, Chong

AU - White, Douglas

AU - Scearce, Stephen

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