Design Issues of BAW Employment in 3D integrated Sensor Nodes

Josef Prainsack, Markus Dielacher, Martin Flatscher, Thomas Herndl, Rainer Matischek, Jörn Stolle, Werner Weber

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration & Packaging of MEMS/MOEMS
Publisher.
Pages81-85
Publication statusPublished - 2009
EventSymposium on Design, Test, Integration & Packaging of MEMS/MOEMS - Rome, Italy
Duration: 1 Apr 20093 Apr 2009

Conference

ConferenceSymposium on Design, Test, Integration & Packaging of MEMS/MOEMS
CountryItaly
CityRome
Period1/04/093/04/09

Treatment code (Nähere Zuordnung)

  • Application

Cite this

Prainsack, J., Dielacher, M., Flatscher, M., Herndl, T., Matischek, R., Stolle, J., & Weber, W. (2009). Design Issues of BAW Employment in 3D integrated Sensor Nodes. In Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (pp. 81-85). ..