Design Issues of BAW Employment in 3D integrated Sensor Nodes

Josef Prainsack, Markus Dielacher, Martin Flatscher, Thomas Herndl, Rainer Matischek, Jörn Stolle, Werner Weber

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration & Packaging of MEMS/MOEMS
Publisher.
Pages81-85
Publication statusPublished - 2009
EventSymposium on Design, Test, Integration & Packaging of MEMS/MOEMS - Rome, Italy
Duration: 1 Apr 20093 Apr 2009

Conference

ConferenceSymposium on Design, Test, Integration & Packaging of MEMS/MOEMS
CountryItaly
CityRome
Period1/04/093/04/09

Treatment code (Nähere Zuordnung)

  • Application

Cite this

Prainsack, J., Dielacher, M., Flatscher, M., Herndl, T., Matischek, R., Stolle, J., & Weber, W. (2009). Design Issues of BAW Employment in 3D integrated Sensor Nodes. In Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (pp. 81-85). ..

Design Issues of BAW Employment in 3D integrated Sensor Nodes. / Prainsack, Josef; Dielacher, Markus; Flatscher, Martin; Herndl, Thomas; Matischek, Rainer; Stolle, Jörn; Weber, Werner.

Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS. ., 2009. p. 81-85.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Prainsack, J, Dielacher, M, Flatscher, M, Herndl, T, Matischek, R, Stolle, J & Weber, W 2009, Design Issues of BAW Employment in 3D integrated Sensor Nodes. in Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS. ., pp. 81-85, Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, Rome, Italy, 1/04/09.
Prainsack J, Dielacher M, Flatscher M, Herndl T, Matischek R, Stolle J et al. Design Issues of BAW Employment in 3D integrated Sensor Nodes. In Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS. . 2009. p. 81-85
Prainsack, Josef ; Dielacher, Markus ; Flatscher, Martin ; Herndl, Thomas ; Matischek, Rainer ; Stolle, Jörn ; Weber, Werner. / Design Issues of BAW Employment in 3D integrated Sensor Nodes. Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS. ., 2009. pp. 81-85
@inproceedings{c392d4793a914bb08e77bfde7b72f844,
title = "Design Issues of BAW Employment in 3D integrated Sensor Nodes",
author = "Josef Prainsack and Markus Dielacher and Martin Flatscher and Thomas Herndl and Rainer Matischek and J{\"o}rn Stolle and Werner Weber",
year = "2009",
language = "English",
pages = "81--85",
booktitle = "Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS",
publisher = ".",

}

TY - GEN

T1 - Design Issues of BAW Employment in 3D integrated Sensor Nodes

AU - Prainsack, Josef

AU - Dielacher, Markus

AU - Flatscher, Martin

AU - Herndl, Thomas

AU - Matischek, Rainer

AU - Stolle, Jörn

AU - Weber, Werner

PY - 2009

Y1 - 2009

M3 - Conference contribution

SP - 81

EP - 85

BT - Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS

PB - .

ER -