Design Issues of BAW Employment in 3D integrated Sensor Nodes

Josef Prainsack, Markus Dielacher, Martin Flatscher, Thomas Herndl, Rainer Matischek, Jörn Stolle, Werner Weber

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Original language	English
Title of host publication	Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS
Publisher	.
Pages	81-85
Publication status	Published - 2009
Event	Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS - Rome, Italy Duration: 1 Apr 2009 → 3 Apr 2009

Conference	Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS
Country/Territory	Italy
City	Rome
Period	1/04/09 → 3/04/09

Treatment code (Nähere Zuordnung)

@inproceedings{c392d4793a914bb08e77bfde7b72f844,

title = "Design Issues of BAW Employment in 3D integrated Sensor Nodes",

author = "Josef Prainsack and Markus Dielacher and Martin Flatscher and Thomas Herndl and Rainer Matischek and J{\"o}rn Stolle and Werner Weber",

year = "2009",

language = "English",

pages = "81--85",

booktitle = "Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS",

publisher = ".",

note = "Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS ; Conference date: 01-04-2009 Through 03-04-2009",

}

TY - GEN

T1 - Design Issues of BAW Employment in 3D integrated Sensor Nodes

AU - Prainsack, Josef

AU - Dielacher, Markus

AU - Flatscher, Martin

AU - Herndl, Thomas

AU - Matischek, Rainer

AU - Stolle, Jörn

AU - Weber, Werner

PY - 2009

Y1 - 2009

M3 - Conference paper

SP - 81

EP - 85

BT - Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS

PB - .

T2 - Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS

Y2 - 1 April 2009 through 3 April 2009

ER -