Design issues of BAW employment in 3D integrated sensor nodes

Josef Prainsack, Markus Dielacher, Martin Flatscher, Thomas Herndl, Rainer Matischek, Jörn Stolle, Werner Weber

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)1037-1043
JournalMicrosystem technologies
Volume16
Issue number7
DOIs
Publication statusPublished - 2010

Treatment code (Nähere Zuordnung)

  • Application

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