Design issues of BAW employment in 3D integrated sensor nodes

Josef Prainsack, Markus Dielacher, Martin Flatscher, Thomas Herndl, Rainer Matischek, Jörn Stolle, Werner Weber

Research output: Contribution to journalArticleResearchpeer-review

Original languageEnglish
Pages (from-to)1037-1043
JournalMicrosystem technologies
Volume16
Issue number7
DOIs
Publication statusPublished - 2010

Treatment code (Nähere Zuordnung)

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Prainsack, J., Dielacher, M., Flatscher, M., Herndl, T., Matischek, R., Stolle, J., & Weber, W. (2010). Design issues of BAW employment in 3D integrated sensor nodes. Microsystem technologies, 16(7), 1037-1043. https://doi.org/10.1007/s00542-009-0938-7

Design issues of BAW employment in 3D integrated sensor nodes. / Prainsack, Josef; Dielacher, Markus; Flatscher, Martin; Herndl, Thomas; Matischek, Rainer; Stolle, Jörn; Weber, Werner.

In: Microsystem technologies, Vol. 16, No. 7, 2010, p. 1037-1043.

Research output: Contribution to journalArticleResearchpeer-review

Prainsack, J, Dielacher, M, Flatscher, M, Herndl, T, Matischek, R, Stolle, J & Weber, W 2010, 'Design issues of BAW employment in 3D integrated sensor nodes' Microsystem technologies, vol. 16, no. 7, pp. 1037-1043. https://doi.org/10.1007/s00542-009-0938-7
Prainsack J, Dielacher M, Flatscher M, Herndl T, Matischek R, Stolle J et al. Design issues of BAW employment in 3D integrated sensor nodes. Microsystem technologies. 2010;16(7):1037-1043. https://doi.org/10.1007/s00542-009-0938-7
Prainsack, Josef ; Dielacher, Markus ; Flatscher, Martin ; Herndl, Thomas ; Matischek, Rainer ; Stolle, Jörn ; Weber, Werner. / Design issues of BAW employment in 3D integrated sensor nodes. In: Microsystem technologies. 2010 ; Vol. 16, No. 7. pp. 1037-1043.
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