Correlation of thin film measurement techniques for device packing processes

W. Mack, J. Walter, C.Y. Lee, Christian Gspan

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationInternational Symposium for Testing and Failure Analysis
Publisher.
Pages192-197
Publication statusPublished - 2014
EventInternational Symposium for Testing and Failure Analysis - Houston, Texas, United States
Duration: 9 Nov 201413 Nov 2014

Conference

ConferenceInternational Symposium for Testing and Failure Analysis
CountryUnited States
CityHouston, Texas
Period9/11/1413/11/14

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

Cite this

Mack, W., Walter, J., Lee, C. Y., & Gspan, C. (2014). Correlation of thin film measurement techniques for device packing processes. In International Symposium for Testing and Failure Analysis (pp. 192-197). ..