Comparison of Harmonic Suppression Techniques

Rahul Nadgouda, Bernd Deutschmann

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To reduce electromagnetic emissions in AM band, harmonic suppression techniques are implemented on the IC level. Literature on harmonic suppression techniques like Digital Harmonic Cancellation and Selective Harmonic Elimination are available in abundance. These techniques are generally employed in low frequency domain (50 Hz line inverters). However, power efficiency (PE) of these techniques in the classical definition of PE has not been the focus so far. PE becomes especially important when these techniques are used for applications demanding high power levels at the output. This paper presents a comparison of some important harmonic suppression techniques to reduce electromagnetic emissions and their effects on PE.

Original languageEnglish
Title of host publicationEMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
PublisherInstitute of Electrical and Electronics Engineers
Pages272-274
Number of pages3
ISBN (Electronic)9781728142616
DOIs
Publication statusPublished - 1 Oct 2019
Event12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits - Haining, Hangzhou, China
Duration: 21 Oct 201923 Oct 2019

Conference

Conference12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
Abbreviated titleEMC COMPO 2019
CountryChina
CityHaining, Hangzhou
Period21/10/1923/10/19

Keywords

  • Electromagnetic Emission
  • Harmonic Cancellation
  • Linearity
  • Power Amplifiers
  • Power Efficiency

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Radiation

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  • Cite this

    Nadgouda, R., & Deutschmann, B. (2019). Comparison of Harmonic Suppression Techniques. In EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (pp. 272-274). [8919834] Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EMCCompo.2019.8919834