Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Runbing Hua, Omid Hoseini Izadi, Zhekun Peng, Hideki Shumiya, Shota Konno, Kenji Araki, David Johannes Pommerenke, DongHyun Kim

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review

Abstract

An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.
Original languageEnglish
Title of host publication2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
Pages200-204
Number of pages5
ISBN (Electronic)978-1-7281-7430-3
DOIs
Publication statusPublished - Jul 2020
Event2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity: EMCSI 2020 - Virtual, Reno, United States
Duration: 27 Jul 202031 Jul 2020

Conference

Conference2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity
Abbreviated titleEMCSI 2020
CountryUnited States
CityVirtual, Reno
Period27/07/2031/07/20

Keywords

  • electrostatic discharge
  • soft-failure
  • USB IC susceptibility

ASJC Scopus subject areas

  • Information Systems and Management
  • Safety, Risk, Reliability and Quality
  • Signal Processing
  • Radiation
  • Electrical and Electronic Engineering

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