Abstract
An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.
Original language | English |
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Title of host publication | 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020 |
Pages | 200-204 |
Number of pages | 5 |
ISBN (Electronic) | 978-1-7281-7430-3 |
DOIs | |
Publication status | Published - Jul 2020 |
Event | 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity: EMCSI 2020 - Virtual, Reno, United States Duration: 27 Jul 2020 → 31 Jul 2020 |
Conference
Conference | 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity |
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Abbreviated title | EMCSI 2020 |
Country/Territory | United States |
City | Virtual, Reno |
Period | 27/07/20 → 31/07/20 |
Keywords
- electrostatic discharge
- soft-failure
- USB IC susceptibility
ASJC Scopus subject areas
- Information Systems and Management
- Safety, Risk, Reliability and Quality
- Signal Processing
- Radiation
- Electrical and Electronic Engineering