Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Thomas Rainer Langbauer*, Christian Mentin, Michael Rindler, Franz Vollmaier, Alexander Connaughton, Klaus Krischan

*Corresponding author for this work

Research output: Contribution to conferencePaper

Original languageEnglish
Pages1-6
Number of pages6
Publication statusPublished - 27 Sep 2019
EventInternational Workshop Thermal Investigation of ICs and Systems: Therminic - Politecnico di Milano – Polo di Lecco Campus, Lecco, Italy
Duration: 25 Sep 201927 Sep 2019
Conference number: 25
https://therminic2019.eu/

Conference

ConferenceInternational Workshop Thermal Investigation of ICs and Systems
Abbreviated titleTherminic 2019
CountryItaly
CityLecco
Period25/09/1927/09/19
Internet address

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