Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Thomas Rainer Langbauer; Christian Mentin; Michael Rindler; Franz Vollmaier; Alexander Connaughton; Klaus Krischan

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Thomas Rainer Langbauer^*, Christian Mentin, Michael Rindler, Franz Vollmaier, Alexander Connaughton, Klaus Krischan

^*Corresponding author for this work

Research output: Contribution to conference › Paper

Original language	English
Pages	1-6
Number of pages	6
Publication status	Published - 27 Sep 2019
Event	International Workshop Thermal Investigation of ICs and Systems: Therminic - Politecnico di Milano – Polo di Lecco Campus, Lecco, Italy Duration: 25 Sep 2019 → 27 Sep 2019 Conference number: 25 https://therminic2019.eu/

Conference

Conference	International Workshop Thermal Investigation of ICs and Systems
Abbreviated title	Therminic 2019
Country	Italy
City	Lecco
Period	25/09/19 → 27/09/19
Internet address	https://therminic2019.eu/

Access to Document

https://ieeexplore.ieee.org/document/8923595

1 Talk at conference or symposium

Gekoppelte elektro-thermische Simulation: Methodik zur Entwicklung eines bidirektionalen Onboard Chargers mit hoher Leistungsdichte
Thomas Rainer Langbauer (Speaker), Alexander Michael Connaughton (Contributor), Franz Vollmaier (Contributor), Christian Mentin (Contributor), Michael Rindler (Contributor), Rudolf Krall (Contributor), Klaus Krischan (Contributor)
13 Feb 2020
Activity: Talk or presentation › Talk at conference or symposium › Science to science

Cite this

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions. / Langbauer, Thomas Rainer; Mentin, Christian; Rindler, Michael; Vollmaier, Franz ; Connaughton, Alexander ; Krischan, Klaus.

2019. 1-6 Paper presented at International Workshop Thermal Investigation of ICs and Systems, Lecco, Italy.

Research output: Contribution to conference › Paper

@conference{4895daf9486e41458d7316d173ad6024,

title = "Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.",

author = "Langbauer, {Thomas Rainer} and Christian Mentin and Michael Rindler and Franz Vollmaier and Alexander Connaughton and Klaus Krischan",

year = "2019",

month = "9",

day = "27",

language = "English",

pages = "1--6",

note = "International Workshop Thermal Investigation of ICs and Systems : Therminic, Therminic 2019 ; Conference date: 25-09-2019 Through 27-09-2019",

url = "https://therminic2019.eu/",

}

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Conference

Access to Document

Gekoppelte elektro-thermische Simulation: Methodik zur Entwicklung eines bidirektionalen Onboard Chargers mit hoher Leistungsdichte

Cite this