Chip, Chip arrangement and method for producing a chip

Walther Pachler (Inventor), Gerald Holweg (Inventor), Günther Hofer (Inventor), Thomas Herndl (Inventor)

Research output: PatentResearch

Original languageGerman
Patent numberUS patent based on 102013109200.4
Publication statusSubmitted - 26 Aug 2013

Fields of Expertise

  • Information, Communication & Computing

Cite this

Pachler, W., Holweg, G., Hofer, G., & Herndl, T. (2013). Chip, Chip arrangement and method for producing a chip. Manuscript submitted for publication. (Patent No. US patent based on 102013109200.4).

Chip, Chip arrangement and method for producing a chip. / Pachler, Walther (Inventor); Holweg, Gerald (Inventor); Hofer, Günther (Inventor); Herndl, Thomas (Inventor).

Patent No.: US patent based on 102013109200.4.

Research output: PatentResearch

Pachler, W, Holweg, G, Hofer, G & Herndl, T 2013, Chip, Chip arrangement and method for producing a chip, Patent No. US patent based on 102013109200.4.
Pachler W, Holweg G, Hofer G, Herndl T, inventors. Chip, Chip arrangement and method for producing a chip. US patent based on 102013109200.4. 2013 Aug 26.
Pachler, Walther (Inventor) ; Holweg, Gerald (Inventor) ; Hofer, Günther (Inventor) ; Herndl, Thomas (Inventor). / Chip, Chip arrangement and method for producing a chip. Patent No.: US patent based on 102013109200.4.
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note = "Anmelder: Infineon Technologies AG;; US patent based on 102013109200.4",
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