Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation

Shishuang Sun*, David Pommerenke, James Drewniak, Kai Xiao, Sin Ting Chen, Tzong Lin Wu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a 3-D power bus structure. The results are compared to either measurement data or other numerical results. The limitations of the method are also discussed.

Original languageEnglish
Title of host publication2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
Pages550-555
Number of pages6
Publication statusPublished - 1 Dec 2006
Externally publishedYes
Event2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 - Portland, OR, United States
Duration: 14 Aug 200618 Aug 2006

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
Volume2
ISSN (Print)1077-4076

Conference

Conference2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
CountryUnited States
CityPortland, OR
Period14/08/0618/08/06

Keywords

  • Equivalent circuit
  • FDTD
  • Power dilivery network
  • SPICE

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • Cite this

    Sun, S., Pommerenke, D., Drewniak, J., Xiao, K., Chen, S. T., & Wu, T. L. (2006). Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation. In 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 (pp. 550-555). [1706366] (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2).