Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation

Shishuang Sun; David Pommerenke; James Drewniak; Kai Xiao; Sin Ting Chen; Tzong Lin Wu

doi:10.1109/ISEMC.2006.1706366

Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation

Shishuang Sun^*, David Pommerenke, James Drewniak, Kai Xiao, Sin Ting Chen, Tzong Lin Wu

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

A novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a 3-D power bus structure. The results are compared to either measurement data or other numerical results. The limitations of the method are also discussed.

Original language	English
Title of host publication	2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
Pages	550-555
Number of pages	6
DOIs	https://doi.org/10.1109/ISEMC.2006.1706366
Publication status	Published - 1 Dec 2006
Externally published	Yes
Event	2006 IEEE International Symposium on Electromagnetic Compatibility: EMC 2006 - Portland, United States Duration: 14 Aug 2006 → 18 Aug 2006

Conference

Conference	2006 IEEE International Symposium on Electromagnetic Compatibility
Country/Territory	United States
City	Portland
Period	14/08/06 → 18/08/06

Keywords

Equivalent circuit
FDTD
Power dilivery network
SPICE

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/ISEMC.2006.1706366

Cite this

Sun, S, Pommerenke, D, Drewniak, J, Xiao, K, Chen, ST & Wu, TL 2006, Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation. in 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006., 1706366, pp. 550-555, 2006 IEEE International Symposium on Electromagnetic Compatibility, Portland, Oregon, United States, 14/08/06. https://doi.org/10.1109/ISEMC.2006.1706366

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title = "Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation",

abstract = "A novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a 3-D power bus structure. The results are compared to either measurement data or other numerical results. The limitations of the method are also discussed.",

keywords = "Equivalent circuit, FDTD, Power dilivery network, SPICE",

author = "Shishuang Sun and David Pommerenke and James Drewniak and Kai Xiao and Chen, {Sin Ting} and Wu, {Tzong Lin}",

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doi = "10.1109/ISEMC.2006.1706366",

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AU - Sun, Shishuang

AU - Pommerenke, David

AU - Drewniak, James

AU - Xiao, Kai

AU - Chen, Sin Ting

AU - Wu, Tzong Lin

PY - 2006/12/1

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N2 - A novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a 3-D power bus structure. The results are compared to either measurement data or other numerical results. The limitations of the method are also discussed.

AB - A novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a 3-D power bus structure. The results are compared to either measurement data or other numerical results. The limitations of the method are also discussed.

KW - Equivalent circuit

KW - FDTD

KW - Power dilivery network

KW - SPICE

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BT - 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006

T2 - 2006 IEEE International Symposium on Electromagnetic Compatibility

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ER -

Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation

Abstract

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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