Characterization of Moisture Uptake in Microelectronics Packaging Materials

Fabian Huber, Harald Etschmaier, Archim Wolfberger, Anderson Singulani, Peter Hadley

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Abstract

Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).

Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Electronic)9781538668139
DOIs
Publication statusPublished - 26 Nov 2018
Externally publishedYes
Event7th Electronic System-Integration Technology Conference - Dresden, Germany
Duration: 18 Sep 201821 Sep 2018

Conference

Conference7th Electronic System-Integration Technology Conference
Abbreviated titleSTC 2018
CountryGermany
CityDresden
Period18/09/1821/09/18

Fingerprint

Packaging materials
Microelectronics
Moisture
Epoxy Compounds
Free volume
Polymer matrix
Encapsulation
Optoelectronic devices
Fourier transform infrared spectroscopy
Analytical models
Atmospheric humidity
Packaging
Hydrogen bonds
Polymers
Water
Sensors
Temperature

Keywords

  • ATR-FTIR
  • diffusion
  • EMC
  • FEA
  • microelectronics
  • packaging materials
  • reliability
  • spectroscopy

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Huber, F., Etschmaier, H., Wolfberger, A., Singulani, A., & Hadley, P. (2018). Characterization of Moisture Uptake in Microelectronics Packaging Materials. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings [8546489] Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESTC.2018.8546489

Characterization of Moisture Uptake in Microelectronics Packaging Materials. / Huber, Fabian; Etschmaier, Harald; Wolfberger, Archim; Singulani, Anderson; Hadley, Peter.

2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 2018. 8546489.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Huber, F, Etschmaier, H, Wolfberger, A, Singulani, A & Hadley, P 2018, Characterization of Moisture Uptake in Microelectronics Packaging Materials. in 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings., 8546489, Institute of Electrical and Electronics Engineers, 7th Electronic System-Integration Technology Conference, Dresden, Germany, 18/09/18. https://doi.org/10.1109/ESTC.2018.8546489
Huber F, Etschmaier H, Wolfberger A, Singulani A, Hadley P. Characterization of Moisture Uptake in Microelectronics Packaging Materials. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers. 2018. 8546489 https://doi.org/10.1109/ESTC.2018.8546489
Huber, Fabian ; Etschmaier, Harald ; Wolfberger, Archim ; Singulani, Anderson ; Hadley, Peter. / Characterization of Moisture Uptake in Microelectronics Packaging Materials. 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 2018.
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