| Original language | English |
|---|---|
| Title of host publication | 17th IEEE European Test Symposium (ETS) |
| Publisher | . |
| Pages | 62-67 |
| ISBN (Print) | 978-1-4673-0697-3 |
| Publication status | Published - 2012 |
| Event | 17th IEEE European Test Symposium (ETS) - , France Duration: 28 May 2012 → 1 Jun 2012 |
Conference
| Conference | 17th IEEE European Test Symposium (ETS) |
|---|---|
| Country | France |
| Period | 28/05/12 → 1/06/12 |
Fields of Expertise
- Information, Communication & Computing
Treatment code (Nähere Zuordnung)
- Application
- Experimental
Cite this
Krieg, A., Grinschgl, J., Steger, C., Weiß, R., Genser, A., Bock, H., & Haid, J. (2012). Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs. In 17th IEEE European Test Symposium (ETS) (pp. 62-67). ..
Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs. / Krieg, Armin; Grinschgl, Johannes; Steger, Christian; Weiß, Reinhold; Genser, Andreas; Bock, Holger; Haid, Josef.
17th IEEE European Test Symposium (ETS). ., 2012. p. 62-67.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Research › peer-review
Krieg, A, Grinschgl, J, Steger, C, Weiß, R, Genser, A, Bock, H & Haid, J 2012, Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs. in 17th IEEE European Test Symposium (ETS). ., pp. 62-67, 17th IEEE European Test Symposium (ETS), France, 28/05/12.
Krieg A, Grinschgl J, Steger C, Weiß R, Genser A, Bock H et al. Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs. In 17th IEEE European Test Symposium (ETS). . 2012. p. 62-67
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title = "Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs",
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AU - Genser, Andreas
AU - Bock, Holger
AU - Haid, Josef
PY - 2012
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M3 - Conference contribution
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