Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs

Armin Krieg, Johannes Grinschgl, Christian Steger, Reinhold Weiß, Andreas Genser, Holger Bock, Josef Haid

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

LanguageEnglish
Title of host publication17th IEEE European Test Symposium (ETS)
Publisher.
Pages62-67
ISBN (Print)978-1-4673-0697-3
StatusPublished - 2012
Event17th IEEE European Test Symposium (ETS) - , France
Duration: 28 May 20121 Jun 2012

Conference

Conference17th IEEE European Test Symposium (ETS)
CountryFrance
Period28/05/121/06/12

Fields of Expertise

  • Information, Communication & Computing

Treatment code (Nähere Zuordnung)

  • Application
  • Experimental

Cite this

Krieg, A., Grinschgl, J., Steger, C., Weiß, R., Genser, A., Bock, H., & Haid, J. (2012). Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs. In 17th IEEE European Test Symposium (ETS) (pp. 62-67). ..

Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs. / Krieg, Armin; Grinschgl, Johannes; Steger, Christian; Weiß, Reinhold; Genser, Andreas; Bock, Holger; Haid, Josef.

17th IEEE European Test Symposium (ETS). ., 2012. p. 62-67.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Krieg, A, Grinschgl, J, Steger, C, Weiß, R, Genser, A, Bock, H & Haid, J 2012, Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs. in 17th IEEE European Test Symposium (ETS). ., pp. 62-67, 17th IEEE European Test Symposium (ETS), France, 28/05/12.
Krieg A, Grinschgl J, Steger C, Weiß R, Genser A, Bock H et al. Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs. In 17th IEEE European Test Symposium (ETS). .2012. p. 62-67.
Krieg, Armin ; Grinschgl, Johannes ; Steger, Christian ; Weiß, Reinhold ; Genser, Andreas ; Bock, Holger ; Haid, Josef. / Characterization and Handling of Low-Cost Micro-Architectural Signatures in MPSoCs. 17th IEEE European Test Symposium (ETS). ., 2012. pp. 62-67
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