Characterising Soft-Failures in Component-Level ESD Testing

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)
PublisherIEEE Xplore
Pages93-96
Number of pages4
ISBN (Electronic) 978-1-5386-5387-6
DOIs
Publication statusPublished - Jul 2018
Event2018 14th Conference on Ph.D. Research in Microelectronics and Electronics - Faculty of Nuclear Sciences and Physical Engineering, Czech Technical University in Prague, Prague, Czech Republic
Duration: 2 Jul 20185 Jul 2018

Conference

Conference2018 14th Conference on Ph.D. Research in Microelectronics and Electronics
Abbreviated titlePRIME
CountryCzech Republic
CityPrague
Period2/07/185/07/18

Activities

  • 2 Talk at conference or symposium
  • 1 Conference or symposium (Participation in/Organisation of)

Characterising Soft-Failures in Component-Level ESD Testing

Patrick Schrey (Speaker)
3 Jul 2018

Activity: Talk or presentationTalk at conference or symposiumScience to science

2018 14th Conference on Ph.D. Research in Microelectronics and Electronics

Patrick Schrey (Participant)
2 Jul 20185 Jul 2018

Activity: Participation in or organisation ofConference or symposium (Participation in/Organisation of)

Characterising Soft-Failures in Component-Level ESD Testing

Patrick Schrey (Speaker)
3 Jul 2018

Activity: Talk or presentationTalk at conference or symposiumScience to science

Cite this

Schrey, P. (2018). Characterising Soft-Failures in Component-Level ESD Testing. In 2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) (pp. 93-96). IEEE Xplore. https://doi.org/10.1109/PRIME.2018.8430342