Characterising Soft-Failures in Component-Level ESD Testing

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

LanguageEnglish
Title of host publication2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)
PublisherIEEE Xplore
Pages93-96
Number of pages4
ISBN (Electronic) 978-1-5386-5387-6
DOIs
StatusPublished - Jul 2018
Event2018 14th Conference on Ph.D. Research in Microelectronics and Electronics - Faculty of Nuclear Sciences and Physical Engineering, Czech Technical University in Prague, Prague, Czech Republic
Duration: 2 Jul 20185 Jul 2018

Conference

Conference2018 14th Conference on Ph.D. Research in Microelectronics and Electronics
Abbreviated titlePRIME
CountryCzech Republic
CityPrague
Period2/07/185/07/18

Cite this

Schrey, P. (2018). Characterising Soft-Failures in Component-Level ESD Testing. In 2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) (pp. 93-96). IEEE Xplore. DOI: 10.1109/PRIME.2018.8430342

Characterising Soft-Failures in Component-Level ESD Testing. / Schrey, Patrick.

2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME). IEEE Xplore, 2018. p. 93-96.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Schrey, P 2018, Characterising Soft-Failures in Component-Level ESD Testing. in 2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME). IEEE Xplore, pp. 93-96, 2018 14th Conference on Ph.D. Research in Microelectronics and Electronics, Prague, Czech Republic, 2/07/18. DOI: 10.1109/PRIME.2018.8430342
Schrey P. Characterising Soft-Failures in Component-Level ESD Testing. In 2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME). IEEE Xplore. 2018. p. 93-96. Available from, DOI: 10.1109/PRIME.2018.8430342
Schrey, Patrick. / Characterising Soft-Failures in Component-Level ESD Testing. 2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME). IEEE Xplore, 2018. pp. 93-96
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