Application of chip-level EMC in automotive product design

K. Hu*, H. Weng, D. Beetner, D. Pommerenke, J. Drewniak, K. Lavery, J. Whiles

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Integrated circuits (ICs) are often the source of the high-frequency noise that drives electromagnetic emissions from electronic products. A case study is presented where emissions from a printed circuit board containing an automotive microcontroller are reduced significantly through analysis of the coupling mechanisms from the chip to the board and attached cables. Noise generated by the IC is explored through measurements in a semi-anechoic chamber and TEM cell, through near-field scans, and through modifications to the printed circuit board. Noise is driven by the IC through both power and I/O connections. Results show that a ferrite in series with I/O power in this application reduced emissions by 10 dB or more at critical frequencies. Possible causes for emissions from the IC and modifications that might reduce these emissions are discussed.

Original languageEnglish
Title of host publication2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
Pages842-848
Number of pages7
Publication statusPublished - 1 Dec 2006
Externally publishedYes
Event2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 - Portland, OR, United States
Duration: 14 Aug 200618 Aug 2006

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
Volume3
ISSN (Print)1077-4076

Conference

Conference2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
CountryUnited States
CityPortland, OR
Period14/08/0618/08/06

Keywords

  • Automotive
  • Coupling
  • Electromagnetic compatibility
  • Emissions
  • Integrated circuits

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • Cite this

    Hu, K., Weng, H., Beetner, D., Pommerenke, D., Drewniak, J., Lavery, K., & Whiles, J. (2006). Application of chip-level EMC in automotive product design. In 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 (pp. 842-848). [1706428] (IEEE International Symposium on Electromagnetic Compatibility; Vol. 3).