Anticipating EMI and on-board interference in automotive platforms

Shishuang Sun*, Geping Liu, David J. Pommerenke, James L. Drewniak, Richard W. Kautz, Chingchi Chen

*Corresponding author for this work

Research output: Contribution to journalConference article

Abstract

A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, the full-vehicle emissions from the automotive harness and the common-mode discontinuities of the vehicle chassis can be predicted. The effectiveness and limitation of this approach have been demonstrated in a controlled laboratory environment.

Original languageEnglish
Pages (from-to)792-797
Number of pages6
JournalIEEE International Symposium on Electromagnetic Compatibility
Volume3
Publication statusPublished - 8 Oct 2004
Externally publishedYes
Event2004 International Symposium on Electromagnetic Compatibility, EMC 2004 - Santa Clara, CA, United States
Duration: 9 Aug 200413 Aug 2004

Keywords

  • Automotive EMC
  • Common-mode current
  • FDTD multi-wire subcelluar algorithm
  • Multi-conductor transmission line (MTL)

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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