Anticipating EMI and on-board interference in automotive platforms

Shishuang Sun; Geping Liu; David J. Pommerenke; James L. Drewniak; Richard W. Kautz; Chingchi Chen

Anticipating EMI and on-board interference in automotive platforms

Shishuang Sun^*, Geping Liu, David J. Pommerenke, James L. Drewniak, Richard W. Kautz, Chingchi Chen

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

Abstract

A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, the full-vehicle emissions from the automotive harness and the common-mode discontinuities of the vehicle chassis can be predicted. The effectiveness and limitation of this approach have been demonstrated in a controlled laboratory environment.

Original language	English
Pages (from-to)	792-797
Number of pages	6
Journal	IEEE International Symposium on Electromagnetic Compatibility
Volume	3
Publication status	Published - 8 Oct 2004
Externally published	Yes
Event	2004 IEEE International Symposium on Electromagnetic Compatibility: EMC 2004 - Santa Clara, United States Duration: 9 Aug 2004 → 13 Aug 2004

Keywords

Automotive EMC
Common-mode current
FDTD multi-wire subcelluar algorithm
Multi-conductor transmission line (MTL)

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

Cite this

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title = "Anticipating EMI and on-board interference in automotive platforms",

abstract = "A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, the full-vehicle emissions from the automotive harness and the common-mode discontinuities of the vehicle chassis can be predicted. The effectiveness and limitation of this approach have been demonstrated in a controlled laboratory environment.",

keywords = "Automotive EMC, Common-mode current, FDTD multi-wire subcelluar algorithm, Multi-conductor transmission line (MTL)",

author = "Shishuang Sun and Geping Liu and Pommerenke, {David J.} and Drewniak, {James L.} and Kautz, {Richard W.} and Chingchi Chen",

year = "2004",

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day = "8",

language = "English",

volume = "3",

pages = "792--797",

journal = "IEEE International Symposium on Electromagnetic Compatibility",

issn = "1077-4076",

publisher = "Institute of Electrical and Electronics Engineers",

note = "2004 IEEE International Symposium on Electromagnetic Compatibility : EMC 2004 ; Conference date: 09-08-2004 Through 13-08-2004",

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T1 - Anticipating EMI and on-board interference in automotive platforms

AU - Sun, Shishuang

AU - Liu, Geping

AU - Pommerenke, David J.

AU - Drewniak, James L.

AU - Kautz, Richard W.

AU - Chen, Chingchi

PY - 2004/10/8

Y1 - 2004/10/8

N2 - A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, the full-vehicle emissions from the automotive harness and the common-mode discontinuities of the vehicle chassis can be predicted. The effectiveness and limitation of this approach have been demonstrated in a controlled laboratory environment.

AB - A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, the full-vehicle emissions from the automotive harness and the common-mode discontinuities of the vehicle chassis can be predicted. The effectiveness and limitation of this approach have been demonstrated in a controlled laboratory environment.

KW - Automotive EMC

KW - Common-mode current

KW - FDTD multi-wire subcelluar algorithm

KW - Multi-conductor transmission line (MTL)

UR - http://www.scopus.com/inward/record.url?scp=4644372518&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:4644372518

SN - 1077-4076

VL - 3

SP - 792

EP - 797

JO - IEEE International Symposium on Electromagnetic Compatibility

JF - IEEE International Symposium on Electromagnetic Compatibility

T2 - 2004 IEEE International Symposium on Electromagnetic Compatibility

Y2 - 9 August 2004 through 13 August 2004

ER -

Anticipating EMI and on-board interference in automotive platforms

Abstract

Keywords

ASJC Scopus subject areas

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