An application of utilizing the system-efficient-ESD-design (SEED) concept to analyze an LED protection circuit of a cell phone

Tianqi Li*, Junji Maeshima, Hideki Shumiya, David J. Pommerenke, Takashi Yamada, Kenji Araki

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An LED circuit of a cell phone is analyzed using the System-Efficient-ESD- Design (SEED) methodology [1]. The method allows simulation of the ESD current path, and the interaction mechanisms between the clamp and the on-chip ESD protection circuit. The I-V curve and the non-linear behavior under high current pulses of every component including R, L, C, and ferrite beads are measured and modeled. By combining all of the component models, a complete circuit model is built for predicting the circuit behavior and damaging threshold at a given setting-voltage of a Transmission Line Pulser (TLP).

Original languageEnglish
Title of host publicationEMC 2012 - 2012 IEEE International Symposium on Electromagnetic Compatibility, Final Program
Pages346-350
Number of pages5
DOIs
Publication statusPublished - 12 Dec 2012
Externally publishedYes
Event2012 IEEE International Symposium on Electromagnetic Compatibility, EMC 2012 - Pittsburgh, PA, United States
Duration: 5 Aug 201210 Aug 2012

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

Conference2012 IEEE International Symposium on Electromagnetic Compatibility, EMC 2012
CountryUnited States
CityPittsburgh, PA
Period5/08/1210/08/12

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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    Li, T., Maeshima, J., Shumiya, H., Pommerenke, D. J., Yamada, T., & Araki, K. (2012). An application of utilizing the system-efficient-ESD-design (SEED) concept to analyze an LED protection circuit of a cell phone. In EMC 2012 - 2012 IEEE International Symposium on Electromagnetic Compatibility, Final Program (pp. 346-350). [6351824] (IEEE International Symposium on Electromagnetic Compatibility). https://doi.org/10.1109/ISEMC.2012.6351824