A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging

Fabian Huber, Harald Etschmaier, Hans Walter, Georg Johann Urstöger, Peter Hadley

Research output: Contribution to journalArticle

Abstract

Time–temperature superposition is a well-established principle used in the constitutive description of viscoelastic polymers. To expand the description to moisture-induced plasticization effects, two epoxide-based molding compounds used in microelectronics packaging were characterized by dynamic mechanical analysis under varying temperature and moisture controlled environments in their glassy regime. Conditions of up to 85 °C and 85% relative humidity, relevant for industry-defined reliability standards, were applied. By relating the transient ambient conditions to the actual moisture concentration of the samples, temperature-, and moisture concentration-dependent relaxation functions were obtained. By applying a time–temperature–moisture concentration superposition, it is shown, that the materials' behavior can be described assuming a linear dependence of the relative free volume on both temperature and concentration. The two parameters can be super-positioned in the description of the shift of the relaxation time constant spectrum with negligible cross-correlation for the conditions of industrial interest.
Original languageEnglish
Pages (from-to)467-478
Number of pages12
JournalInternational Journal of Polymer Analysis and Characterization
Volume25
Issue number6
DOIs
Publication statusPublished - 2020

Keywords

  • moisture
  • packaging
  • Plasticization
  • time–temperature–moisture concentration superposition
  • viscoelasticity

ASJC Scopus subject areas

  • Analytical Chemistry
  • Chemical Engineering(all)
  • Polymers and Plastics

Fingerprint Dive into the research topics of 'A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging'. Together they form a unique fingerprint.

Cite this