A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits

Timm Ostermann, C. Bacher, D. Schneider, W. Gut, C. Lackner, R. Koessl, R. Hagelauer, Bernd Deutschmann, R. Jungreithmair

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationInternational Symposium on Electromagnetic Compatibility
Publisher.
Pages44-47
ISBN (Print)0-7803-7779-6
DOIs
Publication statusPublished - 2003
EventInternational Symposium on Electromagnetic Compatibility - Istanbul, Turkey
Duration: 11 May 200316 May 2003

Conference

ConferenceInternational Symposium on Electromagnetic Compatibility
CountryTurkey
CityIstanbul
Period11/05/0316/05/03

Fields of Expertise

  • Sonstiges

Cite this

Ostermann, T., Bacher, C., Schneider, D., Gut, W., Lackner, C., Koessl, R., ... Jungreithmair, R. (2003). A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits. In International Symposium on Electromagnetic Compatibility (pp. 44-47). .. https://doi.org/10.1109/ICSMC2.2003.1428188

A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits. / Ostermann, Timm; Bacher, C.; Schneider, D.; Gut, W.; Lackner, C.; Koessl, R.; Hagelauer, R.; Deutschmann, Bernd; Jungreithmair, R.

International Symposium on Electromagnetic Compatibility. ., 2003. p. 44-47.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Ostermann, T, Bacher, C, Schneider, D, Gut, W, Lackner, C, Koessl, R, Hagelauer, R, Deutschmann, B & Jungreithmair, R 2003, A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits. in International Symposium on Electromagnetic Compatibility. ., pp. 44-47, International Symposium on Electromagnetic Compatibility, Istanbul, Turkey, 11/05/03. https://doi.org/10.1109/ICSMC2.2003.1428188
Ostermann T, Bacher C, Schneider D, Gut W, Lackner C, Koessl R et al. A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits. In International Symposium on Electromagnetic Compatibility. . 2003. p. 44-47 https://doi.org/10.1109/ICSMC2.2003.1428188
Ostermann, Timm ; Bacher, C. ; Schneider, D. ; Gut, W. ; Lackner, C. ; Koessl, R. ; Hagelauer, R. ; Deutschmann, Bernd ; Jungreithmair, R. / A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits. International Symposium on Electromagnetic Compatibility. ., 2003. pp. 44-47
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