A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits

Timm Ostermann, C. Bacher, D. Schneider, W. Gut, C. Lackner, R. Koessl, R. Hagelauer, Bernd Deutschmann, R. Jungreithmair

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationInternational Symposium on Electromagnetic Compatibility
Publisher.
Pages44-47
ISBN (Print)0-7803-7779-6
DOIs
Publication statusPublished - 2003
EventInternational Symposium on Electromagnetic Compatibility - Istanbul, Turkey
Duration: 11 May 200316 May 2003

Conference

ConferenceInternational Symposium on Electromagnetic Compatibility
CountryTurkey
CityIstanbul
Period11/05/0316/05/03

Fields of Expertise

  • Sonstiges

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