A system-on-chip NFC bicycle tire pressure measurement system

Carolin Kollegger, Philipp Greiner, Christoph Steffan, Heiko Froehlich, Thoralf Kautzsch, Gerald Holweg, Bernd Deutschmann

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review

Abstract

This paper presents a monolithically implemented NFC bicycle tire pressure measurement system (BTPMS) with integrated antenna, on-chip capacitive pressure and temperature sensor, RFID interface for HF/NFC and EEPROM. This NFC BTPMS has been designed using a 130 nm standard CMOS process and has an active chip area of 5.76 mm2. It provides significant cost advantages and impresses with its large scale integration. The used ISO 14443 RFID communication protocol ensures compatibility with state-of-the-art NFC devices. Configuration and calibration data are stored in the integrated EEP-ROM. This battery less stand-alone system is powered wirelessly by any state-of-the-art near field communication device. Using a two-point calibration technique, various measurements have been performed and analyzed regarding accuracy, sensitivity, reproducibility, and temperature dependency. In the pressure range of 1 bar to 6 bar and for temperatures between -15°C to 55°C a ±3σ accuracy of ±0.4 bar is achieved.

Original languageEnglish
Title of host publication2017 IEEE 60th International Midwest Symposium on Circuits and Systems, MWSCAS 2017
PublisherInstitute of Electrical and Electronics Engineers
Pages60-63
Number of pages4
Volume2017-August
ISBN (Electronic)9781509063895
DOIs
Publication statusPublished - 27 Sept 2017
Event60th IEEE International Midwest Symposium on Circuits and Systems - Boston, United States
Duration: 6 Aug 20179 Aug 2017

Conference

Conference60th IEEE International Midwest Symposium on Circuits and Systems
Abbreviated titleMWSCAS 2017
Country/TerritoryUnited States
CityBoston
Period6/08/179/08/17

Keywords

  • 130nm
  • CMOS
  • NFC
  • On-chip pressure sensor
  • RFID
  • System-on-chip
  • Tire pressure system

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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