A study on correlation between near-field EMI scan and ESD susceptibility of ICs

Ahmad Hosseinbeig, Omid Hoseini Izadi, Satyajeet Shinde, David Pommerenke, Hideki Shumiya, Junji Maeshima, Kenji Araki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Correlation between near-field EMI scan and ESD susceptibility scan of a cellphone CPU IC is investigated. It is shown that the ESD susceptibility of the CPU IC depends on the activity of the IC. Based on the obtained correlation between these two scans, it is sufficient to perform the ESD susceptibility scan only by running the application which highly loads the CPU. This reduces the ESD susceptibility measurement time as well as the probability of physical damage to the IC.

Original languageEnglish
Title of host publication2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers
Pages169-174
Number of pages6
ISBN (Electronic)9781538622308
DOIs
Publication statusPublished - 20 Oct 2017
Externally publishedYes
Event2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Washington, United States
Duration: 7 Aug 201711 Aug 2017

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

Conference2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017
CountryUnited States
CityWashington
Period7/08/1711/08/17

Keywords

  • EMI
  • ESD
  • soft failure
  • TLP

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • Cite this

    Hosseinbeig, A., Izadi, O. H., Shinde, S., Pommerenke, D., Shumiya, H., Maeshima, J., & Araki, K. (2017). A study on correlation between near-field EMI scan and ESD susceptibility of ICs. In 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings (pp. 169-174). [8077861] (IEEE International Symposium on Electromagnetic Compatibility). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ISEMC.2017.8077861