A robust wireless sensor network for in-tire-pressure monitoring

Martin Flatscher; Markus Dielacher; Thomas Herndl; Thomas Lentsch; Rainer Matischek; Josef Prainsack; Wolfgang Pribyl; Horst Theuss; Werner Weber

doi:10.1109/ISSCC.2009.4977420

A robust wireless sensor network for in-tire-pressure monitoring

Martin Flatscher, Markus Dielacher, Thomas Herndl, Thomas Lentsch, Rainer Matischek, Josef Prainsack, Wolfgang Pribyl, Horst Theuss, Werner Weber

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Original language	English
Title of host publication	ISSCC Digest of Technical Papers
Place of Publication	Piscataway, NJ
Publisher	Institute of Electrical and Electronics Engineers
Pages	286-287
ISBN (Print)	978-1-4244-3458-9
DOIs	https://doi.org/10.1109/ISSCC.2009.4977420
Publication status	Published - 2009
Event	2009 IEEE International Solid-State Circuits Conference: ISSCC 2009 - San Francisco, United States Duration: 8 Feb 2009 → 12 Feb 2009

Conference

Conference	2009 IEEE International Solid-State Circuits Conference
Country/Territory	United States
City	San Francisco
Period	8/02/09 → 12/02/09

Treatment code (Nähere Zuordnung)

Application

Access to Document

10.1109/ISSCC.2009.4977420

Cite this

Flatscher, M, Dielacher, M, Herndl, T, Lentsch, T, Matischek, R, Prainsack, J, Pribyl, W, Theuss, H & Weber, W 2009, A robust wireless sensor network for in-tire-pressure monitoring. in ISSCC Digest of Technical Papers. Institute of Electrical and Electronics Engineers, Piscataway, NJ, pp. 286-287, 2009 IEEE International Solid-State Circuits Conference, San Francisco, United States, 8/02/09. https://doi.org/10.1109/ISSCC.2009.4977420

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doi = "10.1109/ISSCC.2009.4977420",

language = "English",

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booktitle = "ISSCC Digest of Technical Papers",

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AU - Flatscher, Martin

AU - Dielacher, Markus

AU - Herndl, Thomas

AU - Lentsch, Thomas

AU - Matischek, Rainer

AU - Prainsack, Josef

AU - Pribyl, Wolfgang

AU - Theuss, Horst

AU - Weber, Werner

PY - 2009

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DO - 10.1109/ISSCC.2009.4977420

M3 - Conference paper

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EP - 287

BT - ISSCC Digest of Technical Papers

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway, NJ

T2 - 2009 IEEE International Solid-State Circuits Conference

Y2 - 8 February 2009 through 12 February 2009

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