A Novel 3D Packaging Concept for RF Powered Sensor Grains

Walther Pachler; Klaus Pressel; Jasmin Grosinger; Gottfried Beer; Wolfgang Bösch; Gerald Holweg; Christian Zilch; Manfred Meindl

doi:10.1109/ECTC.2014.6897440

A Novel 3D Packaging Concept for RF Powered Sensor Grains

Walther Pachler, Klaus Pressel, Jasmin Grosinger, Gottfried Beer, Wolfgang Bösch, Gerald Holweg, Christian Zilch, Manfred Meindl

Institute of Microwave and Photonic Engineering (4510)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Research › peer-review

Original language	English
Title of host publication	IEEE 64th Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers
Pages	1183-1188
DOIs	https://doi.org/10.1109/ECTC.2014.6897440
Publication status	Published - 2014
Event	IEEE Electronic Components and Technology Conference - Orlando, United States Duration: 27 May 2014 → 30 May 2014

Conference

Conference	IEEE Electronic Components and Technology Conference
Country	United States
City	Orlando
Period	27/05/14 → 30/05/14

Fields of Expertise

Information, Communication & Computing

Treatment code (Nähere Zuordnung)

Experimental
Application

Cite this

Pachler, W., Pressel, K., Grosinger, J., Beer, G., Bösch, W., Holweg, G., ... Meindl, M. (2014). A Novel 3D Packaging Concept for RF Powered Sensor Grains. In IEEE 64th Electronic Components and Technology Conference (pp. 1183-1188). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ECTC.2014.6897440

A Novel 3D Packaging Concept for RF Powered Sensor Grains. / Pachler, Walther; Pressel, Klaus; Grosinger, Jasmin; Beer, Gottfried; Bösch, Wolfgang; Holweg, Gerald; Zilch, Christian; Meindl, Manfred.

IEEE 64th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers, 2014. p. 1183-1188.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Research › peer-review

Pachler, W, Pressel, K, Grosinger, J, Beer, G, Bösch, W, Holweg, G, Zilch, C & Meindl, M 2014, A Novel 3D Packaging Concept for RF Powered Sensor Grains. in IEEE 64th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers, pp. 1183-1188, IEEE Electronic Components and Technology Conference, Orlando, United States, 27/05/14. https://doi.org/10.1109/ECTC.2014.6897440

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AU - Beer, Gottfried

AU - Bösch, Wolfgang

AU - Holweg, Gerald

AU - Zilch, Christian

AU - Meindl, Manfred

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Access to Document

10.1109/ECTC.2014.6897440

A Novel 3D Packaging Concept for RF Powered Sensor Grains

Conference

Fields of Expertise

Treatment code (Nähere Zuordnung)

Cite this

Access to Document

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