A Novel 3D Packaging Concept for RF Powered Sensor Grains

Walther Pachler, Klaus Pressel, Jasmin Grosinger, Gottfried Beer, Wolfgang Bösch, Gerald Holweg, Christian Zilch, Manfred Meindl

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationIEEE 64th Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers
Pages1183-1188
DOIs
Publication statusPublished - 2014
EventIEEE Electronic Components and Technology Conference - Orlando, United States
Duration: 27 May 201430 May 2014

Conference

ConferenceIEEE Electronic Components and Technology Conference
CountryUnited States
CityOrlando
Period27/05/1430/05/14

Fields of Expertise

  • Information, Communication & Computing

Treatment code (Nähere Zuordnung)

  • Experimental
  • Application

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