A Novel 3D Packaging Concept for RF Powered Sensor Grains

Walther Pachler, Klaus Pressel, Jasmin Grosinger, Gottfried Beer, Wolfgang Bösch, Gerald Holweg, Christian Zilch, Manfred Meindl

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationIEEE 64th Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers
Pages1183-1188
DOIs
Publication statusPublished - 2014
EventIEEE Electronic Components and Technology Conference - Orlando, United States
Duration: 27 May 201430 May 2014

Conference

ConferenceIEEE Electronic Components and Technology Conference
CountryUnited States
CityOrlando
Period27/05/1430/05/14

Fields of Expertise

  • Information, Communication & Computing

Treatment code (Nähere Zuordnung)

  • Experimental
  • Application

Cite this

Pachler, W., Pressel, K., Grosinger, J., Beer, G., Bösch, W., Holweg, G., ... Meindl, M. (2014). A Novel 3D Packaging Concept for RF Powered Sensor Grains. In IEEE 64th Electronic Components and Technology Conference (pp. 1183-1188). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ECTC.2014.6897440