A hybrid approach to decrease port influence in transmission line charaterization

Jianmin Zhang*, David J. Pommerenke, James L. Drewniak, Richard E. DuBroff, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review


Characterization and models for multi-gigabit signaling is an important issue in modern digital system. A good physical based model relies on a precise characterization of the test board. Typically, the characterization of the test board is associated with scattering matrix parameter measurement, which can be done with a VNA (Vector Network Analyzer) in the frequency-domain or a TDR (Time Domain Reflectometer) in the time-domain. The commonly used launch techniques on PCBs (Printed Circuit Boards) associated with the VNA or TDR measurement in the microwave frequency range use SMA or 3.5 mm connectors, in edge-launch or vertical-launch fashions. The transition between the launch port and the DUT (Device Under Test) introduces errors in the measurement. Embedding/deembedding techniques are used to remove the port influences in the measurement generally. For example, TRL (Through, Reflect, and Line) calibration is the typical method used in measurement to eliminate port influences. However, extra test kits are needed for TRL calibration, and furthermore the TRL calibration is sometimes difficult to implement, such as in coupled differential lines. In this paper, an effective hybrid approach for transmission line characterization is proposed, which includes choosing a suitable port launch technique for the test board, port parasitic parameters estimation, and building up a proper circuit model for evaluation with genetic algorithms (GA).

Original languageEnglish
Title of host publication2005 International Symposium on Electromagnetic Compatibility, EMC 2005
Number of pages6
Publication statusPublished - 1 Dec 2005
Externally publishedYes
Event2005 International Symposium on Electromagnetic Compatibility: EMC 2005 - Chicago, United States
Duration: 8 Aug 200512 Aug 2005

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076


Conference2005 International Symposium on Electromagnetic Compatibility
Country/TerritoryUnited States


  • Genetic algorithm
  • Lossy transmission line characterization
  • Parasitic parameter estimation
  • Port launch technique
  • Signal integrity
  • TDR measurement
  • VNA measurement

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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