@inproceedings{c57549e778494a558e26944f07996467,
title = "A circuit model for ESD performance analysis of printed circuit boards",
abstract = "This paper provides a SPICE-eompatible circuit model for characterizing electrostatic discharge (ESD) clamping performance of protection devices mounted on printed circuit boards (PCBs). An equivalent circuit model for a commercial ESD generator is introduced and a simulation methodology of an ESD protection device with non-linear resistance characteristic using voltage controlled current source is described. These models combined to create a full circuit model with a PCB model in a SPICE-like circuit simulator. Comparison results between the simulated and measured are presented to verify the accuracy of the proposed circuit model. A trade-off analysis between the ESD clamping performance and signal integrity with the ESD protection device in high-speed applications is also presented as a case study.",
author = "Seol, {Byong Su} and Lee, {Jong Sung} and Lim, {Jae Deok} and Hyungseok Lee and Harkbyeong Park and Argha Nandy and David Pommerenke",
year = "2008",
month = dec,
day = "1",
doi = "10.1109/EDAPS.2008.4736014",
language = "English",
isbn = "9781424426331",
series = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings",
pages = "120--123",
booktitle = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings",
note = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 ; Conference date: 10-12-2008 Through 12-12-2008",
}