3D MEMS and IC Integration

Maaike Margrete Visser Taklo, Nicolas Lietaer, Hannah Rosquist Tofteberg, Timo Seppänen, Josef Prainsack, Josef Weber, Peter Ramm

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationSymposium E: Materials and Technologies for 3-D Integration
Publisher.
Pages1-8
DOIs
Publication statusPublished - 2008
EventMaterials Research Society Fall Meeting - Boston, United States
Duration: 1 Dec 20085 Dec 2008

Conference

ConferenceMaterials Research Society Fall Meeting
CountryUnited States
CityBoston
Period1/12/085/12/08

Treatment code (Nähere Zuordnung)

  • Application

Cite this

Visser Taklo, M. M., Lietaer, N., Rosquist Tofteberg, H., Seppänen, T., Prainsack, J., Weber, J., & Ramm, P. (2008). 3D MEMS and IC Integration. In Symposium E: Materials and Technologies for 3-D Integration (pp. 1-8). .. https://doi.org/10.1557/PROC-1112-E04-04