In the production of microchips in the semi-conductor industry, the surface of silica wafers is processed by etching fluids. Innovative process equipment for this treatment is developed and commercialised by our cooperation partner. During the process, the silica wafers are positioned on a rotating chuck, and the surface is wetted with the etching fluid. A variety of procedures exist, applying various fluids in a wide range of operating temperatures. Correct fluid temperature under the conditions of operation is the most important factor for each of the different processes. The international clientele requires high flexibility of the processing facility, since differences in the climatic conditions exhibit strong influence on the storing conditions for the highly aggressive working media. Therefore, the demands on the heat transfer units are high. In the basic concept, four heat exchanging units are combined to ensure constant fluid temperature at the point of use. The present diploma work focuses on the improvement of heat transfer and handling, enhanced cooling rates and cost effectiveness. The existing facility was analysed with respect to the aforementioned aspects, and possibilities of optimisation were proposed.
|Effective start/end date||1/09/01 → 28/02/02|