2022 IEEE International Symposium of Electromagnetic Compatibility Student Paper Award

  • Zhang, W. (Recipient), Mi, Rui (Recipient) & Khilkevich, V. (Recipient)

Prize: Prizes / Medals / Awards


For the paper co-authored with Wei Zhang, and Victor Khilkevichtitled “3D Printed Multilayer Microwave Absorber", presented at the2022 IEEE International Symposium on Electromagnetic Compatibility.
Degree of recognitionInternational
Granting OrganisationsIEEE Electromagnetic Compatibility Society (EMC-S)

Awarded at event

Event title2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity
LocationSpokane, WA, USA, Spokane, United StatesShow on map
Period1 Aug 2022 → 5 Aug 2022

Austrian Fields of Study 2012 (6-stellig)

  • 202016 Electrical engineering