Wolfgang Bösch

Univ.-Prof. Dipl.-Ing. Dr.techn., MBA

20102024

Research activity per year

Network

Gerald Holweg

  • Infineon Technologies Austria AG
  • Graz University of Technology

External person

Christian Schuberth

  • Infineon Technologies Austria AG

External person

Ulrich Muhlmann

  • NXP Semiconductors Austria GmbH
  • NXP Semiconductors

External person

Peter Singerl

  • Infineon Technologies AG

External person

Lukas Zöscher

  • NXP Semiconductors
  • Graz University of Technology
  • NXP Semiconductors Austria GmbH

External person

Erich Schlaffer

  • AT&S Austria Technologie & Systemtechnik

External person

Peter Priller

  • AVL List GmbH

External person

Muehlmann, Ulrich

  • NXP Semiconductors

External person

Patrick Reynaert

  • University of Leuven

External person

Johannes Sturm

  • Fachhochschule Kärnten
  • Fachhochschule Kärnten, ISCD Studentenlabor

External person

Horst Pflügl

  • AVL List GmbH

External person

Hunter, Ian C.

  • University of Leeds

External person

Alexander Standaert

  • University of Leuven

External person

Watzinger, Hubert

  • NXP Semiconductors
  • NXP Semiconductors Austria GmbH

External person

Rui Xu

  • University of Kent, School of Engineering and Digital Arts

External person

Chad Bartlett

  • Kiel University

External person

Benito Sanz-Izquierdo

  • Queen’s University Belfast
  • University of Kent

External person

Steffen Metzner

  • AVL List GmbH

External person

Herkess, Peter

  • NXP Semiconductors Austria GmbH

External person

Gibbons, Gregory

  • University of Warwick

External person

Franz Amtmann

  • NXP Semiconductors
  • NXP Semiconductors Austria GmbH

External person

Ajinkya Kale

  • Silicon Austria Labs GmbH
  • Fachhochschule Kärnten
  • Fachhochschule Kärnten, ISCD Studentenlabor
  • Center for VLSI and Embedded System Technologies

External person

Michael Paulweber

  • AVL List GmbH

External person

Chao Gu

  • Queen’s University Belfast
  • University of Kent, School of Engineering and Digital Arts

External person

Graciele Batistell

  • Fachhochschule Kärnten
  • Graz University of Technology
  • Fachhochschule Kärnten, ISCD Studentenlabor

External person

Thomas Herndl

  • Infineon Technologies Austria AG

External person

Carlos Carceller

  • Kyocera International

External person

Ahmad Alterkawi

  • Graz University of Technology

External person

H. S. Farahani

  • Graz University of Technology

External person

Jim Mayock

  • Viper RF

External person

Thomas Schwingshackl

  • Infineon Technologies AG
  • Graz University of Technology

External person

Schultes, Gerhard

  • Maxim Integrated

External person

Gigl, Thomas

  • Maxim Integrated

External person

Antonio Jonjic

  • Infineon Technologies Austria AG

External person

Manfred Stadler

  • EPCOS AG
  • Qualcomm Austria Research Center Gmbh

External person

Zemen, Thomas

  • FTW Forschungszentrum Telekommunikation Wien

External person

Christoph Steffan

  • Infineon Technologies Austria AG

External person

Bernhard Reitmaier

  • AT&S Austria Technologie & Systemtechnik

External person

Addulrahman Widaa

  • Kiel University

External person

Vincent Fusco

  • Queen’s University Belfast

External person

Werner Simbürger

  • Infineon Technologies AG

External person

Jerome Bodart

  • EUROCONTROL

External person

Oscar Quevedo-Teruel

  • KTH Royal Institute of Technology

External person

Hazrati Marangal, Amin

  • Silicon Austria Labs GmbH

External person

Jorge D. Martínez

  • Universitat Politècnica de València

External person

Mojtaba Fallahpour

  • Missouri University of Science and Technology, Rolla

External person

Stefano Sirci

  • Universitat Politècnica de València

External person

Andrea Bartl

  • Austro Control

External person

David Veit

  • NXP Semiconductors Austria GmbH

External person

Li, Dong

  • Xi’an Institute of Space Radio Technology

External person

Q. Sun

  • Viper RF

External person

Ralph Prestros

  • Silicon Austria Labs, GEMC

External person

Harald Gossner

  • Intel Germany GmbH
  • Intel Mobile Communications

External person

Suchendranath Popuri

  • Fachhochschule Kärnten

External person

Jelena Petrusa

  • Joanneum Research, Materials, Laser- und Plasma-Technologien
  • Joanneum Research Forschungsgesellschaft mbH

External person

Johannes Schweighofer

  • Infineon Technologies Austria AG

External person

Matthias Schäfer

  • SeRo Systems GmbH

External person

Joost Willemen

  • Infineon Technologies AG

External person

Eduardo Carrasco

  • Universidad Politécnica de Madrid, Information Processing and Telecommunications Center

External person

Rainer Matischek

  • Infineon Technologies AG

External person

Martin Mataln

  • Infineon Technologies Austria AG

External person

Jim Yip

  • Cantor Technologies Ltd.

External person

Mustazar Iqbal

  • Infineon Technologies Austria AG

External person

Xuexia Yang

  • Shanghai University

External person

Roberto Sorrentino

  • Università degli Studi di Perugia

External person

Marco Pitton

  • Infineon Technologies Austria AG

External person

Siegfried Krainer

  • Infineon Technologies Austria AG

External person

Dmitry, Isakov

  • University of Warwick

External person

Günter Hofer

  • Infineon Technologies AG

External person

Benjamin Meier

  • Graz University of Technology, Institute of Materials Science, Joining and Forming
  • Joanneum Research, Materials
  • Joanneum Research Forschungsgesellschaft mbH
  • Graz University of Technology

External person

Bhagath Talluri

  • Infineon Technologies Nijmegen Bv

External person

Marc Kraft

  • SeRo Systems GmbH

External person

Vijaya Sankara Rao Pasupureddi

  • University of Hyderabad

External person

Herman Jalli Ng

  • Karlsruhe University of Applied Sciences

External person

Martin Mischitz

  • Infineon Technologies Austria AG

External person

Sandra Wilfling

  • Infineon Technologies Austria AG

External person

Miguel Ángel Sánchez-Soriano

  • Universitat Politècnica de València

External person

Luhaib, Saad W. O.

  • University of Leeds

External person

Vicente E. Boria

  • Universitat Politècnica de València

External person

Abdelhamed Eldeeb

  • Fachhochschule Kärnten

External person

Robert Guirado

  • Universidad Politécnica de Madrid

External person

Benjamin J. Orr

  • Missouri University of Science and Technology, Rolla
  • Intel Corporation
  • Intel Mobile Communications

External person

Santiago Sondon

  • Fachhochschule Kärnten

External person

Erich Merlin

  • NXP Semiconductors Austria GmbH

External person

Maurizio Bozzi

  • Università di Pavia

External person

Michael Hoft

  • Kiel University

External person

Rüdiger Quay

  • Fraunhofer Institute of Applied Solid-State Physics IAF

External person