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Rui Mi

BSc MSc

20212021

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  • 3D Printed Electromagnetic Absorber Built with Conductive Carbon-filled Filament

    Mi, R., Zhang, W., Ghosh, K., Walunj, S., Liu, Q., Rollin, J., Sochoux, P., Pommerenke, D. & Khilkevich, V., 26 Jul 2021, 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. Institute of Electrical and Electronics Engineers, p. 266-271 6 p. (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review