Research output per year
Research output per year
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Dive into the research topics where Martin Gottfried Ibel is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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3D modeling of inductive and capacitive coupling between surface-mounted multilayer-capacitors
Riener, C. M., Bauernfeind, T., Baumgartner, P., Hackl, H., Ibel, M. G., Kvasnicka, S., Prestros, R., Roppert, K. & Kaltenbacher, M., 27 Jun 2022, (E-pub ahead of print) In: International Journal of Numerical Modelling. 35, p. 1-20 e3046.Research output: Contribution to journal › Article › peer-review
Open Access -
3D Modelling of Inductive and Capacitive Coupling Between Surface-Mounted Multi-Layer-Capacitors
Riener, C. M., Bauernfeind, T., Baumgartner, P., Hackl, H., Ibel, M. G., Kvasnicka, S., Prestros, R., Roppert, K. & Kaltenbacher, M., Jul 2021, Selected Abstracts of the 12th International Symposium on Electric and Magnetic Fields.Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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Extraction of Single Cell Impedance from within a Battery Pack by Virtual De-Embedding: A Proof of Concept
Hackl, H., Ibel, M., Mologni, J., Pommerenke, D. J. & Auinger, B., 26 Jul 2021, 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. Institute of Electrical and Electronics Engineers, p. 815-819 5 p. (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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Li-Ion Cell Impedance Measurement Using Open/Short/Load Compensation for De-Embedding
Hackl, H., Ibel, M., Landinger, T. F., Pommerenke, D. J. & Auinger, B., 26 Jul 2021, 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. IEEE Publications, p. 190-195 6 p. 9559223. (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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Comparison of BBSPICE to PEEC Equivalent Circuit Models for Simulation of Floating PCB above Ground Plane
Hackl, H., Ibel, M., Auinger, B., Stockreiter, C. & Deutschmann, B., 1 Sep 2019, 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE. Institute of Electrical and Electronics Engineers, p. 19-24 6 p. 8872031. (EMC Europe 2019 - 2019 International Symposium on Electromagnetic Compatibility).Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
Activities
- 1 Talk at conference or symposium
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3D Modelling of Inductive and Capacitive Coupling Between Surface-Mounted Multi-Layer-Capacitors
Christian Manfred Riener (Speaker), Thomas Bauernfeind (Contributor), Paul Baumgartner (Contributor), Herbert Hackl (Contributor), Martin Gottfried Ibel (Contributor), Samuel Kvasnicka (Contributor), Ralph Prestros (Contributor), Klaus Roppert (Contributor) & Manfred Kaltenbacher (Contributor)
6 Jul 2021Activity: Talk or presentation › Talk at conference or symposium › Science to science