Horst Possegger

Horst Possegger

Dipl.-Ing. Dr.techn., BSc

20102024

Research activity per year

Network

Horst Bischof

Person

Hilde Kuehne

  • Goethe University Frankfurt

External person

Kristan Matej

  • University of Ljubljana

External person

Anna Kukleva

  • Max Planck Institute for Informatics

External person

Michael Felsberg

  • Linköping University

External person

Longyin Wen

  • Chinese Academy of Sciences

External person

Gustav Häger

  • Linköping University

External person

Luka Čehovin

  • University of Ljubljana

External person

Gustavo Fernandez Dominguez

  • Austrian Research Centers GmbH

External person

Patrick Ruprecht

  • Institut für Maschinelles Sehen und Darstellen

External person

Stuart Golodetz

  • University of Oxford

External person

Jin Young Choi

  • Seoul National University

External person

Simon Hadfield

  • University of Surrey

External person

Alan Lukežič

  • University of Ljubljana

External person

Mario Edoardo Maresca

  • Università degli Studi di Napoli Parthenope

External person

Tomáš Vojíř

  • Czech Technical University in Prague

External person

Jianke Zhu

  • Zhejiang University

External person

Jiři Matas

  • Czech Technical University in Prague

External person

Richard Bowden

  • University of Surrey

External person

Christophe Garcia

  • Laboratoire d'InfoRmatique en Image et Systèmes d'information

External person

Rogerio Feris

  • MIT-IBM Watson AI Lab

External person

Alfredo Petrosino

  • Università degli Studi di Napoli Parthenope

External person

Stefan Duffner

  • Laboratoire d'InfoRmatique en Image et Systèmes d'information

External person

Leonid Karlinsky

  • MIT-IBM Watson AI Lab

External person

Yang Li

  • Zhejiang University

External person

Bohyung Han

  • Pohang University of Science and Technology

External person

Martin Danelljan

  • Linköping University

External person

Sam Hare

  • Obvious Engineering Limited

External person

Georg Nebehay

  • AIT Austrian Institute of Technology

External person

Kunyang Sun

  • Southeast University

External person

Fahad Shahbaz Khan

  • Linköping University

External person

Philip Torr

  • University of Oxford

External person

Hyeonseob Nam

  • Pohang University of Science and Technology

External person

Karel Lebeda

  • University of Surrey

External person

Aleš Leonardis

  • University of Birmingham

External person

Qiang Wang

  • Chinese Academy of Sciences

External person

Joost van de Weijer

  • Universitat Autònoma de Barcelona

External person

Ji-Wan Kim

  • Electronics and Telecommunications Research Institute

External person

Fatih Porikli

  • Australian National University

External person

Jorge Batista

  • University of Coimbra

External person

Tony Pridmore

  • University of Nottingham

External person

Kimin Yun

  • Seoul National University

External person

Zhenyu He

  • Harbin Institute of Technology

External person

Kin Hong Wong

  • Chinese University of Hong Kong

External person

Pol Jané Soneira

  • Kalsruhe Institute of Technology (KIT)

External person

Junliang Xing

  • Chinese Academy of Sciences

External person

Zhaoyun Chen

  • National University of Defense Technology

External person

Xinchu Shi

  • Chinese Academy of Sciences

External person

Xiaomeng Wang

  • University of Nottingham

External person

Bernard Ghanem

  • King Abdullah University of Science and Technology

External person

Andrés Solís Montero

  • University of Ottawa

External person

Ming-Ming Chang

  • University at Albany-SUNY

External person

Nina Shvetsova

  • Goethe University Frankfurt

External person

Stephen Hicks

  • University of Oxford

External person

Kristoffer Öfjäll

  • Linköping University

External person

Jae-Yeong Lee

  • Electronics and Telecommunications Research Institute

External person

Hing Tuen Yau

  • Chinese University of Hong Kong

External person

In So Kweon

  • Korea Advanced Institute of Science and Technology (KAIST)

External person

Filiz Bunyak

  • University of Missouri

External person

Cherkeng Heng

  • Panasonic R&D Center, Singapore

External person

Jose M. Martinez

  • Universidad Autónoma de Madrid

External person

Baojun Zhao

  • Beijing Institute of Technology

External person

Bo Li

  • The University of Southern Mississippi

External person

Mei Wen

  • National University of Defense Technology

External person

Ming Tang

  • Chinese Academy of Sciences

External person

Salma Moujtahid

  • Université Claude Bernard Lyon 1

External person

Weiming Hu

  • Chinese Academy of Sciences

External person

Lei Luo

  • National University of Defense Technology

External person

Hilke Kieritz

  • Fraunhofer IOSB

External person

Jianping Shi

  • Chinese University of Hong Kong

External person

Karteek Alahari

  • INRIA Grenoble Rhône-Alpes

External person

Dacheng Tao

  • University of Technology Sydney

External person

Yang Lu

  • University of California, San Diego

External person

Nana Fan

  • Harbin Institute of Technology

External person

Hyemin Lee

  • Pohang University of Science and Technology

External person

Matthias Wess

  • Vienna University of Technology

External person

JiJia Li

  • Shanghai Jiao Tong University

External person

Jae-chan Jeong

  • Electronics and Telecommunications Research Institute

External person

Daniel Schnöll

  • Vienna University of Technology

External person

Brais Martinez

  • University of Nottingham

External person

Markus Tilp

  • University of Graz
  • Karl-Franzens-Universität Graz, Institut für Sportwissenschaft

External person

Chaohui Wang

  • Université Paris-Est

External person

Rengarajan Pelapur

  • University of Missouri

External person

Franci Oven

  • University of Ljubljana

External person

Jiatong Li

  • Beijing Institute of Technology

External person

Aleksandar Dimitriev

  • University of Ljubljana

External person

Byeong Ju Lee

  • Seoul National University

External person

Gao Zhu

  • Australian National University

External person

Jae-il Cho

  • Electronics and Telecommunications Research Institute

External person

Michel Valstar

  • University of Nottingham

External person

Zehua Huang

  • Carnegie Mellon University

External person

Yao Shizeng

  • University of Missouri

External person

Muhammad Haris Khan

  • University of Nottingham

External person

Dominik Pangeršič

  • University of Ljubljana

External person

Kwang Moo Yi

  • Swiss Federal Institute of Technology in Lausanne

External person

Marcus Hennecke

  • Infineon Technologies AG
  • Efkon GmbH

External person

Seunghoon Hong

  • Pohang University of Science and Technology

External person

Honggang Qi

  • University at Albany-SUNY

External person

Yuankai Qui

  • Harbin Institute of Technology

External person

Ming-Ching Chang

  • University at Albany-SUNY

External person

Yuezun Li

  • University at Albany-SUNY

External person

Dit-Yan Yeung

  • Hong Kong University of Science and Technology

External person

Zhe Zhang

  • Baidu, Inc.

External person

Stefan Becker

  • University of Erlangen-Nürnberg

External person

Michael Arens

  • Fraunhofer IOSB

External person

Kannappan Palaniappan

  • University of Missouri

External person

Abhinav Gupta

  • Carnegie Mellon University

External person

Kuk-Jin Yoon

  • Korea Advanced Institute of Science and Technology (KAIST)

External person

Xu Zhao

  • Chinese Academy of Sciences

External person

Quingming Huang

  • Harbin Institute of Technology

External person

Emanuele Rodola

  • Università degli Studi di Roma "La Sapienza"

External person

Siyi Li

  • Hong Kong University of Science and Technology

External person

Danil Prokhorov

  • Toyota Research Institute

External person

Stan Z. Li

  • Chinese Academy of Sciences

External person

Adel Bibi

  • King Abdullah University of Science and Technology

External person

Jiaya Jia

  • Chinese University of Hong Kong

External person

Weiyao Lin

  • Shanghai Jiao Tong University

External person

Mahdieh Pootschi

  • University of Missouri

External person

Jin Gao

  • Chinese Academy of Sciences

External person

Tianfu Wu

  • University of California, Los Angeles

External person

Shengcai Liao

  • Chinese Academy of Sciences

External person

Jongwon Choi

  • Seoul National University

External person

Henning Avenhaus

  • KESTRELEYE GmbH

External person

Zhibin Hong

  • University of Technology Sydney

External person

Inkyu Shin

  • Korea Advanced Institute of Science and Technology (KAIST)

External person

Kai Xue

  • Harbin Engineering University

External person

Rameswar Panda

  • MIT-IBM Watson AI Lab

External person

Eraldo Ribeiro

  • Florida Institute of Technology

External person

Zhiheng Niu

  • Panasonic R&D Center, Singapore

External person

Xue Mei

  • Toyota Research Institute

External person

Alvaro Garcia-Martin

  • Universidad Autónoma de Madrid

External person

João F. Henriques

  • University of Oxford

External person

Yang Hua

  • University of Technology Sydney

External person

Daijin Kim

  • Pohang University of Science and Technology

External person

Markus Müller

  • Graz University of Technology, Student

External person

Siwei Lyu

  • University at Albany-SUNY

External person

Axel Jantsch

  • Vienna University of Technology

External person

Ke Gao

  • University of Missouri

External person

Robert Laganière

  • University of Ottawa

External person

Rafael Martin-Nieto

  • IMDEA Software Institute

External person

Lipeng Ke

  • University at Albany-SUNY

External person

Ivan Bogun

  • Florida Institute of Technology

External person

Jin-Woo Choi

  • Electronics and Telecommunications Research Institute

External person

Anton Varfolomieiev

  • National Technical University of Ukraine "Kyiv Polytechnic Institute"

External person

Guna Seetharaman

  • U.S. Naval Research Laboratory

External person

Atilla Baskurt

  • Université Claude Bernard Lyon 1

External person

Wolfgang Hübner

  • Fraunhofer IOSB

External person

Zhe Chen

  • University of Technology Sydney

External person

Sunglok Choi

  • Chinese Academy of Sciences

External person

Song-Chun Zhu

  • Harbin Institute of Technology

External person

Jiayi Feng

  • Chinese Academy of Sciences

External person

Dawei Du

  • University at Albany-SUNY

External person

Xin Li

  • Harbin Institute of Technology
  • Chinese Academy of Sciences

External person

Liang Ma

  • Harbin Engineering University

External person

Matthias Bittner

  • Vienna University of Technology

External person

Zhen Lei

  • Chinese Academy of Sciences

External person

Ondrej Miksik

  • University of Oxford

External person

Mengdan Zhang

  • Chinese Academy of Sciences

External person

Dafei Huang

  • National University of Defense Technology

External person

Jaesung Choe

  • Korea Advanced Institute of Science and Technology (KAIST)

External person

Luca Bertinetto

  • University of Oxford

External person

Chunyuan Zhang

  • National University of Defense Technology

External person

Samantha YueYing Lim

  • Panasonic R & D Center Germany GmbH

External person

Jochen Lang

  • University of Ottawa

External person

Vibhav Vineet

  • University of Oxford

External person

Hongdong Li

  • Australian National University

External person

Cordelia Schmid

  • INRIA Grenoble Rhône-Alpes

External person

Naiyan Wang

  • Hong Kong University of Science and Technology

External person