20152018
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Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 6 Similar Profiles
harnesses Physics & Astronomy
Integrated circuits Engineering & Materials Science
Scattering parameters Engineering & Materials Science
Electromagnetic compatibility Engineering & Materials Science
Convolution Engineering & Materials Science
electromagnetic compatibility Physics & Astronomy
Shielding Engineering & Materials Science
cables Physics & Astronomy

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Research Output 2015 2018

  • 4 Conference contribution
  • 1 Paper

The shielding effect of a multi-cable harness as function of IC output termination impedance

Hackl, H., Auinger, B., Deutschmann, B. & Gheonjian, A., 22 Jun 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers, p. 707-712 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

harnesses
Shielding
cables
shielding
Cables

Computing the electromagnetic emission spectrum of pulses by convolution in frequency domain

Hackl, H. & Deutschmann, B., 2 Nov 2017, 2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE 2017, EMC Europe 2017. Institute of Electrical and Electronics Engineers, 8094699

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Convolution
Detectors
Signal interference
Integrated circuits
Transmitters

Survey on Integrated High-Power Low-EmissionOutput Stages for Drivers of Low-FrequencyResonant Loads

Hackl, H., Auer, M. & Erckert, R., 2017, p. 64-69. 6 p.

Research output: Contribution to conferencePaperResearchpeer-review

Integrated circuits
Natural frequencies
Networks (circuits)

An EMI receiver model to minimize simulation time of long data transmissions

Hackl, H. & Deutschmann, B., 19 Oct 2016, Proceedings - 2016 24th Austrian Workshop on Microelectronics, Austrochip 2016. p. 57-62 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Simulation of radiated emission during the design phase based on scattering parameter measurement

Hackl, H., Winkler, G. & Deutschmann, B., 15 Dec 2015, EMC Compo 2015 - 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits. Institute of Electrical and Electronics Engineers, p. 228-231 4 p. 7358362

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Scattering parameters
Electromagnetic compatibility
electromagnetic compatibility
scattering
simulation