Numerical simulation of hybrid joining processes: self-piercing riveting combined with adhesive bonding

Potgorschek, L. (Contributor), Domitner, J. (Speaker), Florian Hönsch (Contributor), Sommitsch, C. (Contributor), Stefan Kaufmann (Contributor)

Activity: Talk or presentationTalk at conference or symposiumScience to science

Period4 May 2020 - 8 May 2020
Held at23rd International Conference on Material Forming (ESAFORM 2020)
Event typeConference
LocationVirtual Conference
Degree of RecognitionInternational