Window detection in complex facades

Michal Récky, Franz Leberl

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Originalspracheenglisch
Titel2010 2nd European Workshop on Visual Information Processing
ErscheinungsortPiscataway, NY
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten163-168
ISBN (Print)978-142-447-288-8
DOIs
PublikationsstatusVeröffentlicht - 2010
Veranstaltung2nd European Workshop on Visual Information Processing - Paris, Frankreich
Dauer: 5 Jul 20108 Jul 2010

Konferenz

Konferenz2nd European Workshop on Visual Information Processing
LandFrankreich
OrtParis
Zeitraum5/07/108/07/10

Fields of Expertise

  • Information, Communication & Computing

Dies zitieren

Récky, M., & Leberl, F. (2010). Window detection in complex facades. in 2010 2nd European Workshop on Visual Information Processing (S. 163-168). Piscataway, NY: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EUVIP.2010.5699128

Window detection in complex facades. / Récky, Michal; Leberl, Franz.

2010 2nd European Workshop on Visual Information Processing. Piscataway, NY : Institute of Electrical and Electronics Engineers, 2010. S. 163-168.

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Récky, M & Leberl, F 2010, Window detection in complex facades. in 2010 2nd European Workshop on Visual Information Processing. Institute of Electrical and Electronics Engineers, Piscataway, NY, S. 163-168, Paris, Frankreich, 5/07/10. https://doi.org/10.1109/EUVIP.2010.5699128
Récky M, Leberl F. Window detection in complex facades. in 2010 2nd European Workshop on Visual Information Processing. Piscataway, NY: Institute of Electrical and Electronics Engineers. 2010. S. 163-168 https://doi.org/10.1109/EUVIP.2010.5699128
Récky, Michal ; Leberl, Franz. / Window detection in complex facades. 2010 2nd European Workshop on Visual Information Processing. Piscataway, NY : Institute of Electrical and Electronics Engineers, 2010. S. 163-168
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