Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices: Automated assembly of miniaturized PM sensor

Jaka Pribosek, Markus Zauner, Jochen Bardong, Alfred Binder, Paul Maierhofer, Alexander Bergmann, Georg Rohrer

    Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

    Abstract

    In this paper we propose the selective adhesive bonding technique using contact imprinting from thin adhesive layers spin-coated on the sacrificial polyethylene foils. The imprinting is assisted with vacuum release of the polymer foil to reduce the pull-off adhesive force and prevent sticking, posing less constraints on the required lifting force. We apply this method in assembly of a highly integrated optical particle counter confronted with several strict assembly requirements, such as selective bonding with small feature size (<200 μm), minimal adhesive thicknesses (<15μm), precise out-of plane tolerances, low adhesive squeeze-out and hermetically sealed packaging. A successful selective adhesive bonding with ratio of vacuum tool area to adhesive contact area of 1:20 was demonstrated.

    Originalspracheenglisch
    Titel2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings
    Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
    ISBN (elektronisch)9781728116341
    DOIs
    PublikationsstatusVeröffentlicht - 1 Okt 2019
    Veranstaltung18th IEEE Sensors, SENSORS 2019 - Montreal, Kanada
    Dauer: 27 Okt 201930 Okt 2019

    Publikationsreihe

    NameProceedings of IEEE Sensors
    Band2019-October
    ISSN (Print)1930-0395
    ISSN (elektronisch)2168-9229

    Konferenz

    Konferenz18th IEEE Sensors, SENSORS 2019
    LandKanada
    OrtMontreal
    Zeitraum27/10/1930/10/19

    ASJC Scopus subject areas

    • !!Electrical and Electronic Engineering

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  • Dieses zitieren

    Pribosek, J., Zauner, M., Bardong, J., Binder, A., Maierhofer, P., Bergmann, A., & Rohrer, G. (2019). Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices: Automated assembly of miniaturized PM sensor. in 2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings [8956807] (Proceedings of IEEE Sensors; Band 2019-October). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/SENSORS43011.2019.8956807