Thermal Expansion in Pulse - Heating

Thomas Hüpf, Claus Cagran, Gernot Pottlacher

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Originalspracheenglisch
Titel30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES)
Herausgeber (Verlag).
Seiten57-57
PublikationsstatusVeröffentlicht - 2009
Veranstaltung30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES) - Pittsburgh, USA / Vereinigte Staaten
Dauer: 29 Aug 20092 Sep 2009

Konferenz

Konferenz30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES)
LandUSA / Vereinigte Staaten
OrtPittsburgh
Zeitraum29/08/092/09/09

Treatment code (Nähere Zuordnung)

  • Experimental

Dies zitieren

Hüpf, T., Cagran, C., & Pottlacher, G. (2009). Thermal Expansion in Pulse - Heating. in 30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES) (S. 57-57). ..

Thermal Expansion in Pulse - Heating. / Hüpf, Thomas; Cagran, Claus; Pottlacher, Gernot.

30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES). ., 2009. S. 57-57.

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Hüpf, T, Cagran, C & Pottlacher, G 2009, Thermal Expansion in Pulse - Heating. in 30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES). ., S. 57-57, Pittsburgh, USA / Vereinigte Staaten, 29/08/09.
Hüpf T, Cagran C, Pottlacher G. Thermal Expansion in Pulse - Heating. in 30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES). . 2009. S. 57-57
Hüpf, Thomas ; Cagran, Claus ; Pottlacher, Gernot. / Thermal Expansion in Pulse - Heating. 30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES). ., 2009. S. 57-57
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