The evaluation method for ESD immunity of components in terms of soft error

Jaedeok Lim*, Jongsung Lee, Byongsu Seol, Argha Nandy, David Pommerenke

*Korrespondierende/r Autor/in für diese Arbeit

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

A hand-held product like a camera and a mobile-phone must be satisfied with ESD Standard. Mostly IEC 61000-4-2 is applied. In this SET-level ESD test, considerable reason of failure is malfunction of major semiconductor parts (CPU, Memory and Sensor etc.) Recently, due to the semiconductor becoming more refined, high speed and multifunction, that failure trend is getting more general. The importance of cooperation between set developer and component developer has been emphasized in ESD field. Especially, making a correlation in measurement and analytical method is very important. Through this paper, the evaluation method for ESD immunity of components will be suggested for designing ESD robust product.

Originalspracheenglisch
TitelProceedings of EMC Europe 2011 York - 10th International Symposium on Electromagnetic Compatibility
Seiten468-471
Seitenumfang4
PublikationsstatusVeröffentlicht - 14 Dez 2011
Extern publiziertJa
Veranstaltung10th International Symposium on Electromagnetic Compatibility: EMC Europe 2011 - York, Großbritannien / Vereinigtes Königreich
Dauer: 26 Sep 201130 Sep 2011

Publikationsreihe

NameProceedings of EMC Europe 2011 York - 10th International Symposium on Electromagnetic Compatibility

Konferenz

Konferenz10th International Symposium on Electromagnetic Compatibility
LandGroßbritannien / Vereinigtes Königreich
OrtYork
Zeitraum26/09/1130/09/11

ASJC Scopus subject areas

  • !!Electrical and Electronic Engineering

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