SPICE Modeling of Process Variation Using Location Depth Corner Models

Gerhard Rappitsch, Ehrenfried Seebacher, Michael Kocher, Ernst Stadlober

Publikation: Beitrag in einer FachzeitschriftArtikelForschungBegutachtung

Originalspracheenglisch
Seiten (von - bis)201-213
FachzeitschriftIEEE transactions on semiconductor manufacturing
Jahrgang17
Ausgabenummer2
DOIs
PublikationsstatusVeröffentlicht - 2004

Dies zitieren

SPICE Modeling of Process Variation Using Location Depth Corner Models. / Rappitsch, Gerhard; Seebacher, Ehrenfried; Kocher, Michael; Stadlober, Ernst.

in: IEEE transactions on semiconductor manufacturing, Jahrgang 17, Nr. 2, 2004, S. 201-213.

Publikation: Beitrag in einer FachzeitschriftArtikelForschungBegutachtung

Rappitsch, Gerhard ; Seebacher, Ehrenfried ; Kocher, Michael ; Stadlober, Ernst. / SPICE Modeling of Process Variation Using Location Depth Corner Models. in: IEEE transactions on semiconductor manufacturing. 2004 ; Jahrgang 17, Nr. 2. S. 201-213.
@article{b89fb8314b29435aa138d9dc48b6bb64,
title = "SPICE Modeling of Process Variation Using Location Depth Corner Models",
author = "Gerhard Rappitsch and Ehrenfried Seebacher and Michael Kocher and Ernst Stadlober",
year = "2004",
doi = "10.1109/TSM.2004.826940",
language = "English",
volume = "17",
pages = "201--213",
journal = "IEEE transactions on semiconductor manufacturing",
issn = "0894-6507",
publisher = "Institute of Electrical and Electronics Engineers",
number = "2",

}

TY - JOUR

T1 - SPICE Modeling of Process Variation Using Location Depth Corner Models

AU - Rappitsch, Gerhard

AU - Seebacher, Ehrenfried

AU - Kocher, Michael

AU - Stadlober, Ernst

PY - 2004

Y1 - 2004

U2 - 10.1109/TSM.2004.826940

DO - 10.1109/TSM.2004.826940

M3 - Article

VL - 17

SP - 201

EP - 213

JO - IEEE transactions on semiconductor manufacturing

JF - IEEE transactions on semiconductor manufacturing

SN - 0894-6507

IS - 2

ER -