Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Abstract

Electrostatic Discharge immunity is a design challenge for electronic components and systems alike. Unfortunately, component-level Electrostatic Discharge data seldom provides useful information for system design. In order to pick a suitable component to meet the system's Electrostatic Discharge requirements, a more sophisticated characterisation of components with respect to Electrostatic Discharge has to be found. In particular, soft-failures in component-level Electrostatic Discharge testing are required. This paper presents a new soft-failure Electrostatic Discharge characterisation to help system designers.
Originalspracheenglisch
Titel2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Herausgeber (Verlag)IEEE Xplore
Seitenumfang3
DOIs
PublikationsstatusVeröffentlicht - 21 Okt 2019
VeranstaltungThe 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits - Zhejiang University, Haining, China
Dauer: 21 Okt 201923 Okt 2019
http://www.emcconf.org/

Konferenz

KonferenzThe 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
KurztitelEMC Compo
LandChina
OrtHaining
Zeitraum21/10/1923/10/19
Internetadresse

    Fingerprint

Dieses zitieren

Schrey, P. (2019). Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention. in 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) IEEE Xplore. https://doi.org/10.1109/EMCCompo.2019.8919921