Soft-Failures in Component-Level ESD Testing on the Example of a Bandgap

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

To overcome Electrostatic Discharge design challenges of a system, detailed information on the built-in components is mandatory. Unfortunately, component-level Electrostatic Discharge data rarely provides this information. A new characterisation for components with respect to Electrostatic Discharge is required, which in particular includes soft-failures. This paper exemplifies a new soft-failure Electrostatic Discharge characterisation for a bandgap voltage reference and presents the obtainable information.
Originalspracheenglisch
Titel2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Herausgeber (Verlag)IEEE Xplore
Seitenumfang3
DOIs
PublikationsstatusVeröffentlicht - 21 Okt 2019
VeranstaltungThe 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits - Zhejiang University, Haining, China
Dauer: 21 Okt 201923 Okt 2019
http://www.emcconf.org/

Konferenz

KonferenzThe 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
KurztitelEMC Compo
LandChina
OrtHaining
Zeitraum21/10/1923/10/19
Internetadresse

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