Signal link-path characterization up to 20 GHz based on a stripline structure

Jianmin Zhang*, James L. Drewniak, David J. Pommerenke, Richard E. DuBroff, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo

*Korrespondierende/r Autor/in für diese Arbeit

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

Dielectric properties and losses are two critical issues in signal link-path characterization. To obtain the substrate dielectric properties for a planar transmission line, an analytical solution is derived and validated based on a stripline structure and measured scattering parameters with TRL de-embedding. The characterized dielectric property is used to evaluate dielectric loss and conductor loss. The total loss is thereby found from their summation. The calculated total loss is compared to the measured total loss, and the conductor loss and dielectric loss are then quantifiable. Since the conventional description using the loss tangent and dielectric constant to represent material properties is usually insufficient as the frequency reaches 20 GHz, a Debye model is proposed. The second order Debye parameters are subsequently extracted using a genetic algorithm. A full wave simulation is implemented to verify the determination of two-term Debye model parameters.

Originalspracheenglisch
Titel2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
Seiten356-361
Seitenumfang6
PublikationsstatusVeröffentlicht - 1 Dez 2006
Extern publiziertJa
Veranstaltung2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 - Portland, OR, USA / Vereinigte Staaten
Dauer: 14 Aug 200618 Aug 2006

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
Band2
ISSN (Print)1077-4076

Konferenz

Konferenz2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
LandUSA / Vereinigte Staaten
OrtPortland, OR
Zeitraum14/08/0618/08/06

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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