SI and EMI performance comparison of standard QSFP and flyover QSFP connectors for 56+ Gbps applications

Atieh Talebzadeh, Kyoungchoul Koo, Pranay Kumar Vuppunutala, Jim Nadolny, Angela Li, Qian Liu, Philippe Sochoux, David Pommerenke, James L. Drewniak

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

In this paper, signal integrity (SI) and EMI aspects of a novel Flyover Quad Small Form Factor Pluggable (Flyover QSFP) connector is compared to a traditional QSFP connector which are used in 28/56 Gb/s applications. The flyover technique can overcome the limitation of high insertion loss associated with standard surface mount QSFP connectors that use PCB Microstrip traces. In flyover QSFP, substituting 7.5 cm PCB traces with 15 cm twin-ax cables results in at least 7 dB insertion loss improvement at 40 GHz. To study the SI and EMI performances of FQSFP in comparison with standard QSFP, two test vehicles were designed, fabricated, and tested. The return loss, insertion loss, and total radiated power (TRP) of both standard QSFP and flyover QSFP connectors are obtained up to 40 GHz. Based on the results, it is shown that flyover QSFP interconnect exhibits better SI performance due to the lower loss in comparison to the standard QSFP. When the same power is applied to both connectors, similar TRP performance is measured at most of the frequencies with differential excitation.

Originalspracheenglisch
Titel2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten776-781
Seitenumfang6
ISBN (elektronisch)9781538622308
DOIs
PublikationsstatusVeröffentlicht - 20 Okt 2017
Extern publiziertJa
Veranstaltung2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Washington, USA / Vereinigte Staaten
Dauer: 7 Aug 201711 Aug 2017

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (elektronisch)2158-1118

Konferenz

Konferenz2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017
LandUSA / Vereinigte Staaten
OrtWashington
Zeitraum7/08/1711/08/17

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

Fingerprint Untersuchen Sie die Forschungsthemen von „SI and EMI performance comparison of standard QSFP and flyover QSFP connectors for 56+ Gbps applications“. Zusammen bilden sie einen einzigartigen Fingerprint.

Dieses zitieren