Separation and Validation of Bond-Wire and Solder Layer Failure Modes in IGBT Modules

Wenzhao Liu*, Dao Zhou, Francesco Iannuzzo, Michael Hartmann, Frede Blaabjerg

*Korrespondierende/r Autor/-in für diese Arbeit

Publikation: Beitrag in einer FachzeitschriftArtikelBegutachtung

Abstract

Thermal stress of the power semiconductor is one of the most important indicators for the reliability assessment of power electronics-based power systems. The mapping of the Insulated-Gate Bipolar Transistor (IGBT) junction temperature is usually required to analyze the thermal stress and loss dissipation. However, it is difficult to identify inherent mechanisms of the bond-wire and solder layer failure modes in IGBT power modules. In order to solve the problem, an online method to identify inherent mechanisms of the bond-wire and solder layer failure modes in IGBT power modules is proposed. This method can separate the root causes of the bond-wire lift-off and solder layer fatigue by measuring the on-state voltage drop through a sinusoidal loading current based on an H-bridge circuit, together with its corresponding control and measurement. By comparing the on-state voltage drop at the intersection current and the peak current of the converter, the wear-out conditions of the IGBT power modules can be monitored in real-time with the determination of different failure modes. Finally, experimental results are presented in order to verify the effectiveness and feasibility of the proposed method.

Originalspracheenglisch
Aufsatznummer9672744
Seiten (von - bis)2324-2331
Seitenumfang8
FachzeitschriftIEEE Transactions on Industry Applications
Jahrgang58
Ausgabenummer2
DOIs
PublikationsstatusVeröffentlicht - 1 Apr. 2022
Extern publiziertJa

Schlagwörter

  • Insulated gate bipolar transistors
  • Temperature measurement
  • Loading
  • Voltage measurement
  • Fatigue
  • Monitoring
  • Thermal loading

ASJC Scopus subject areas

  • Elektrotechnik und Elektronik
  • Steuerungs- und Systemtechnik
  • Wirtschaftsingenieurwesen und Fertigungstechnik

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