Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates

Harald Etschmaier, Jiri Novak, Hannes Eder, Peter Hadley

Publikation: Beitrag in einer FachzeitschriftArtikelForschungBegutachtung

Abstract

The dynamics and the morphology of the intermetallic phase evolution for isothermal diffusion soldering with the eutectic Au-Sn alloy as the solder material on copper and silver substrates was investigated. The phases involved and the reaction parameters like the rate of the intermetallic layer growth and the activation energy could be determined by in-situ X-ray diffraction. Transmission electron microscopy and energy dispersive X-ray spectroscopy bring further insight into the morphology changes that occur during the process. The results contribute to a better understanding of this advanced joining method extensively used in semiconductor packaging.

Originalspracheenglisch
Seiten (von - bis)87-92
Seitenumfang6
FachzeitschriftIntermetallics
Jahrgang20
Ausgabenummer1
DOIs
PublikationsstatusVeröffentlicht - Jan 2012

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    ASJC Scopus subject areas

    • !!Mechanical Engineering
    • !!Mechanics of Materials
    • !!Materials Chemistry
    • !!Metals and Alloys
    • !!Chemistry(all)

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