PCB ground fill design guidelines for radiated EMI

Weifeng Pan, David Pommerenke, Shuai Xu, Jun Jia

Publikation: Beitrag in einer FachzeitschriftKonferenzartikel

Abstract

This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.

Originalspracheenglisch
Aufsatznummer4652141
FachzeitschriftIEEE International Symposium on Electromagnetic Compatibility
Jahrgang2008-January
DOIs
PublikationsstatusVeröffentlicht - 1 Jan 2008
Extern publiziertJa
Veranstaltung2008 IEEE International Symposium on Electromagnetic Compatibility: EMC 2008 - Detroit, USA / Vereinigte Staaten
Dauer: 18 Aug 200822 Aug 2008

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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