Passive Intermodulation on Coaxial Connector Under Electro-Thermal-Mechanical Multiphysics

Xiong Chen, Ling Wang, David Pommerenke, Ming Yu

Publikation: Beitrag in einer FachzeitschriftArtikelBegutachtung

Abstract

This work proposes and demonstrates a multiphysics model for the passive intermodulation (PIM) effect on coaxial connectors with complex electro-thermal-mechanical coupling. The PIM effect under multiphysics is numerically modeled and solved from the basis of contact components and parameters. In the experimental demonstration, to get rid of the random test error, the design of experiment method is utilized to build an empirical model for verification. The comparison shows the max prediction differences with comparison among the proposed numerical multiphysics model, empirical model, and experiment are within ±3 dB; the good match between the experiment and predictions proves the theory.

Originalspracheenglisch
Seiten (von - bis)169-177
Seitenumfang9
FachzeitschriftIEEE Transactions on Microwave Theory and Techniques
Jahrgang70
Ausgabenummer1
DOIs
PublikationsstatusVeröffentlicht - 1 Jan 2022

ASJC Scopus subject areas

  • Physik der kondensierten Materie
  • Strahlung
  • Elektrotechnik und Elektronik

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